YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003::page 442
    Author:
    Octavio Leon
    ,
    Erik Dick
    ,
    Jan Vierendeels
    ,
    Gilbert De Mey
    DOI: 10.1115/1.1602709
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The performance of an array of staggered and nonstaggered cooling fins is compared, looking not only into the traditional objective of maximum heat transfer flux, but also to obtain it with the minimum flow resistance. Three different models were studied to obtain the ratio between the heat removed and the energy spent for the coolant flow going through the cooling fins. The study is done numerically using the computational fluid dynamic software FLUENT . The results show the advantages of the staggered model compared to the standard model since for a given incoming velocity, the use of a staggered heat sink always leads to a maximization of the heat transfer flux. The significant positive difference in the thermal performance of the staggered model permits the reduction of the incoming velocity with the consequent reduction in the pressure drop, and power consumption. The authors consider this research as a quite interesting approach as compared to other research where the flow resistance has not been taken into account.
    keyword(s): Flow (Dynamics) , Heat transfer , Cooling , Fins , Heat sinks , Heat , Coolants , Pressure drop , Forced convection AND Electrical resistance ,
    • Download: (395.0Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128207
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorOctavio Leon
    contributor authorErik Dick
    contributor authorJan Vierendeels
    contributor authorGilbert De Mey
    date accessioned2017-05-09T00:09:53Z
    date available2017-05-09T00:09:53Z
    date copyrightSeptember, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26221#442_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128207
    description abstractThe performance of an array of staggered and nonstaggered cooling fins is compared, looking not only into the traditional objective of maximum heat transfer flux, but also to obtain it with the minimum flow resistance. Three different models were studied to obtain the ratio between the heat removed and the energy spent for the coolant flow going through the cooling fins. The study is done numerically using the computational fluid dynamic software FLUENT . The results show the advantages of the staggered model compared to the standard model since for a given incoming velocity, the use of a staggered heat sink always leads to a maximization of the heat transfer flux. The significant positive difference in the thermal performance of the staggered model permits the reduction of the incoming velocity with the consequent reduction in the pressure drop, and power consumption. The authors consider this research as a quite interesting approach as compared to other research where the flow resistance has not been taken into account.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleComparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling
    typeJournal Paper
    journal volume125
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1602709
    journal fristpage442
    journal lastpage446
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat transfer
    keywordsCooling
    keywordsFins
    keywordsHeat sinks
    keywordsHeat
    keywordsCoolants
    keywordsPressure drop
    keywordsForced convection AND Electrical resistance
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian