| contributor author | Octavio Leon | |
| contributor author | Erik Dick | |
| contributor author | Jan Vierendeels | |
| contributor author | Gilbert De Mey | |
| date accessioned | 2017-05-09T00:09:53Z | |
| date available | 2017-05-09T00:09:53Z | |
| date copyright | September, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26221#442_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128207 | |
| description abstract | The performance of an array of staggered and nonstaggered cooling fins is compared, looking not only into the traditional objective of maximum heat transfer flux, but also to obtain it with the minimum flow resistance. Three different models were studied to obtain the ratio between the heat removed and the energy spent for the coolant flow going through the cooling fins. The study is done numerically using the computational fluid dynamic software FLUENT . The results show the advantages of the staggered model compared to the standard model since for a given incoming velocity, the use of a staggered heat sink always leads to a maximization of the heat transfer flux. The significant positive difference in the thermal performance of the staggered model permits the reduction of the incoming velocity with the consequent reduction in the pressure drop, and power consumption. The authors consider this research as a quite interesting approach as compared to other research where the flow resistance has not been taken into account. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Comparison Between the Standard and Staggered Layout for Cooling Fins in Forced Convection Cooling | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1602709 | |
| journal fristpage | 442 | |
| journal lastpage | 446 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Heat transfer | |
| keywords | Cooling | |
| keywords | Fins | |
| keywords | Heat sinks | |
| keywords | Heat | |
| keywords | Coolants | |
| keywords | Pressure drop | |
| keywords | Forced convection AND Electrical resistance | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003 | |
| contenttype | Fulltext | |