contributor author | Hideo Koguchi | |
contributor author | Chie Sasaki | |
contributor author | Kazuto Nishida | |
date accessioned | 2017-05-09T00:09:53Z | |
date available | 2017-05-09T00:09:53Z | |
date copyright | September, 2003 | |
date issued | 2003 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26221#414_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128203 | |
description abstract | In the present paper, a deformation induced in a new bonding technology of chip-scale package (CSP) using resin encapsulation sheets is examined numerically and experimentally. Deflections after cooling from a bonding temperature are measured experimentally for various kinds of substrate and the thickness of an integrated circuit using a laser beam. In particular, a simple theory on the basis of a multilayered plate theory considering a viscoelastic property in the substrate is presented, and the thermo-viscoelastic analysis for the deflection of CSP is performed. Furthermore, the thermo-elastoplastic finite element method analysis is performed under the same temperature history. We could show that the simple formula for multilayered plates based on the thermo-viscoelatic theory can estimate fairly well the deflection of CSP in experiment. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermo-Viscoelastic Analysis of Deflection in CSP Electronic Device Packages | |
type | Journal Paper | |
journal volume | 125 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1602705 | |
journal fristpage | 414 | |
journal lastpage | 419 | |
identifier eissn | 1043-7398 | |
keywords | Deflection | |
keywords | Thickness | |
keywords | Temperature AND Plates (structures) | |
tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003 | |
contenttype | Fulltext | |