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    Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

    Source: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003::page 386
    Author:
    Ravi S. Prasher
    ,
    Paul Koning
    ,
    James Shipley
    ,
    Amit Devpura
    DOI: 10.1115/1.1602703
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further compared with the percolation model and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different filler or particle loading. A novel mechanical length scale is defined to understand the mechanical response of these materials, and is correlated to the viscosity of these materials.
    keyword(s): Particulate matter , Thermal conductivity , Contact resistance , Stiffness , Modeling , Polymers AND Fillers (Materials) ,
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      Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/128199
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    contributor authorRavi S. Prasher
    contributor authorPaul Koning
    contributor authorJames Shipley
    contributor authorAmit Devpura
    date accessioned2017-05-09T00:09:52Z
    date available2017-05-09T00:09:52Z
    date copyrightSeptember, 2003
    date issued2003
    identifier issn1528-9044
    identifier otherJEPAE4-26221#386_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/128199
    description abstractThis paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further compared with the percolation model and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different filler or particle loading. A novel mechanical length scale is defined to understand the mechanical response of these materials, and is correlated to the viscosity of these materials.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleDependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction
    typeJournal Paper
    journal volume125
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1602703
    journal fristpage386
    journal lastpage391
    identifier eissn1043-7398
    keywordsParticulate matter
    keywordsThermal conductivity
    keywordsContact resistance
    keywordsStiffness
    keywordsModeling
    keywordsPolymers AND Fillers (Materials)
    treeJournal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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