| contributor author | Ravi S. Prasher | |
| contributor author | Paul Koning | |
| contributor author | James Shipley | |
| contributor author | Amit Devpura | |
| date accessioned | 2017-05-09T00:09:52Z | |
| date available | 2017-05-09T00:09:52Z | |
| date copyright | September, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26221#386_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128199 | |
| description abstract | This paper reports the measurement of the thermal conductivity of particle-laden polymeric thermal interface materials for three different particle volume fractions. The experimental data are further compared with the percolation model and effective medium theory. We then introduce a method of obtaining the contact resistance between the particles and the polymeric matrix by a combination of percolation modeling and experimental data. We also discuss the dependence of the mechanical response of these particle-laden polymers for different filler or particle loading. A novel mechanical length scale is defined to understand the mechanical response of these materials, and is correlated to the viscosity of these materials. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Dependence of Thermal Conductivity and Mechanical Rigidity of Particle-Laden Polymeric Thermal Interface Material on Particle Volume Fraction | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1602703 | |
| journal fristpage | 386 | |
| journal lastpage | 391 | |
| identifier eissn | 1043-7398 | |
| keywords | Particulate matter | |
| keywords | Thermal conductivity | |
| keywords | Contact resistance | |
| keywords | Stiffness | |
| keywords | Modeling | |
| keywords | Polymers AND Fillers (Materials) | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 003 | |
| contenttype | Fulltext | |