Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic DeviceSource: Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004::page 602DOI: 10.1115/1.1604807Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves and charts are also provided for engineering practice convenience. These charts show the interactions of the deflection, stress, temperature, pressure, linear spring constant, rotational spring constant, geometry of the glass windows, and the Young’s modulus, Poisson’s ratio, thermal coefficient of expansion, geometry, stress-optical coefficient, and birefringence of glass materials. The results presented herein should be useful for designing glass windows for shipping, storing, handling, functioning, and reliability.
keyword(s): Glass , Stress , Pressure , Deflection , Temperature , Double refraction AND Thermal stresses ,
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| contributor author | John H. Lau | |
| contributor author | Yida Zou | |
| contributor author | Steve Erasmus | |
| date accessioned | 2017-05-09T00:09:51Z | |
| date available | 2017-05-09T00:09:51Z | |
| date copyright | December, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26225#602_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128185 | |
| description abstract | An exact analysis is presented for the stresses and deflections of circular plates (glass windows) elastically restrained along its edge in a photonic device’s housing subjected to the pressure and temperature loadings. Dimensionless curves and charts are also provided for engineering practice convenience. These charts show the interactions of the deflection, stress, temperature, pressure, linear spring constant, rotational spring constant, geometry of the glass windows, and the Young’s modulus, Poisson’s ratio, thermal coefficient of expansion, geometry, stress-optical coefficient, and birefringence of glass materials. The results presented herein should be useful for designing glass windows for shipping, storing, handling, functioning, and reliability. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Stress and Deflection Analysis of a Glass Window (Circular Plate) Elastically Restrained Along its Edge in a Photonic Device | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1604807 | |
| journal fristpage | 602 | |
| journal lastpage | 608 | |
| identifier eissn | 1043-7398 | |
| keywords | Glass | |
| keywords | Stress | |
| keywords | Pressure | |
| keywords | Deflection | |
| keywords | Temperature | |
| keywords | Double refraction AND Thermal stresses | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004 | |
| contenttype | Fulltext |