| contributor author | L. J. Ernst | |
| contributor author | Guest Editor | |
| contributor author | G. Q. Zhang | |
| contributor author | Guest Editor | |
| date accessioned | 2017-05-09T00:09:49Z | |
| date available | 2017-05-09T00:09:49Z | |
| date copyright | December, 2003 | |
| date issued | 2003 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26225#465_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/128160 | |
| description abstract | This special issue includes selected papers presented at the International Conference of Thermal and Mechanical Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), Paris, May 2001. The annual EuroSimE conference was initiated in 2000, as the only international conference focusing on mechanical, thermal and thermo-mechanical simulation and experiments in microelectronics and microsystems, with financial co-sponsorship from the EC, and technical co-sponsorship of IEEE-CPMT, in order to meet the growing needs and challenges in this rapidly progressing field. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal and Mechanical Simulation and Experiments in Micro-electronics and Microsystems | |
| type | Journal Paper | |
| journal volume | 125 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1634590 | |
| journal fristpage | 465 | |
| identifier eissn | 1043-7398 | |
| keywords | Microelectromechanical systems | |
| keywords | Engineering simulation AND Microelectronic devices | |
| tree | Journal of Electronic Packaging:;2003:;volume( 125 ):;issue: 004 | |
| contenttype | Fulltext | |
