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    Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 001::page 60
    Author:
    Cemal Basaran
    ,
    Assoc. Prof.
    ,
    Rumpa Chandaroy
    ,
    Staff Consultant
    DOI: 10.1115/1.1400752
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Due to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the solder joint experiences cycling shear strain, which leads to short cycle fatigue. When semiconductor devices are used in a vibrating environment, additional strains shorten the fatigue life of a solder joint. Reliability of these joints in new packages is determined by laboratory tests. In order to use the FEM to replace these expensive reliability tests a unified constitutive model for Pb40/Sn60 solder joints has been developed and implemented in a thermo-viscoplastic-dynamic finite element procedure. The model incorporates thermal-elastic-viscoplastic and damage capabilities in a unified manner. The constitutive model has been verified extensively against laboratory test data. The finite element procedure was used for coupled thermo-viscoplastic-dynamic analyses for fatigue life predictions. The results indicate that using Miner’s rule to calculate accumulative damage by means of two separate analyses, namely dynamic and thermo-mechanical, significantly underestimates the accumulative total damage. It is also shown that a simultaneous application of thermal and dynamic loads significantly shortens the fatigue life of the solder joint. In the microelectronic packaging industry it is common practice to ignore the contribution of vibrations to short cycle fatigue life predictions. The results of this study indicate that damage induced in the solder joints by vibrations have to be included in fatigue life predictions to accurately estimate their reliability.
    keyword(s): Solder joints , Fatigue life , Vibration AND Temperature ,
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      Thermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading

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    http://yetl.yabesh.ir/yetl1/handle/yetl/126630
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    contributor authorCemal Basaran
    contributor authorAssoc. Prof.
    contributor authorRumpa Chandaroy
    contributor authorStaff Consultant
    date accessioned2017-05-09T00:07:12Z
    date available2017-05-09T00:07:12Z
    date copyrightMarch, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26201#60_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126630
    description abstractDue to the coefficient of thermal expansion (CTE) mismatch between the bonded layers, the solder joint experiences cycling shear strain, which leads to short cycle fatigue. When semiconductor devices are used in a vibrating environment, additional strains shorten the fatigue life of a solder joint. Reliability of these joints in new packages is determined by laboratory tests. In order to use the FEM to replace these expensive reliability tests a unified constitutive model for Pb40/Sn60 solder joints has been developed and implemented in a thermo-viscoplastic-dynamic finite element procedure. The model incorporates thermal-elastic-viscoplastic and damage capabilities in a unified manner. The constitutive model has been verified extensively against laboratory test data. The finite element procedure was used for coupled thermo-viscoplastic-dynamic analyses for fatigue life predictions. The results indicate that using Miner’s rule to calculate accumulative damage by means of two separate analyses, namely dynamic and thermo-mechanical, significantly underestimates the accumulative total damage. It is also shown that a simultaneous application of thermal and dynamic loads significantly shortens the fatigue life of the solder joint. In the microelectronic packaging industry it is common practice to ignore the contribution of vibrations to short cycle fatigue life predictions. The results of this study indicate that damage induced in the solder joints by vibrations have to be included in fatigue life predictions to accurately estimate their reliability.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermomechanical Analysis of Solder Joints Under Thermal and Vibrational Loading
    typeJournal Paper
    journal volume124
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1400752
    journal fristpage60
    journal lastpage66
    identifier eissn1043-7398
    keywordsSolder joints
    keywordsFatigue life
    keywordsVibration AND Temperature
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian