contributor author | E. H. Wong | |
contributor author | R. Rajoo | |
contributor author | S. W. Koh | |
contributor author | T. B. Lim | |
date accessioned | 2017-05-09T00:07:12Z | |
date available | 2017-05-09T00:07:12Z | |
date copyright | June, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26203#122_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126628 | |
description abstract | A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress modeling were performed. The hygroscopic stress induced through moisture conditioning was found to be significant compared to the thermal stress during solder reflow. Hygroscopic stress in over-molded wire bond PBGA and molded Flip Chip PBGA was found to be 1.3 times to 1.5 times that of thermal stress. Hygroscopic swelling of the underfill in FCPBGA was found to be the main failure driver during autoclave test. Autoclave performance of FCPBGA package assembled with different underfills and chips were analyzed. Excellent correlation was found between autoclave performance and the hygroscopic swelling characteristics of the underfills. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1461367 | |
journal fristpage | 122 | |
journal lastpage | 126 | |
identifier eissn | 1043-7398 | |
keywords | Electronic packaging | |
keywords | Stress | |
keywords | Modeling | |
keywords | Packaging | |
keywords | Thermal stresses | |
keywords | Flip-chip | |
keywords | Diffusion (Physics) | |
keywords | Failure | |
keywords | Thickness AND Wire | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002 | |
contenttype | Fulltext | |