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    The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002::page 122
    Author:
    E. H. Wong
    ,
    R. Rajoo
    ,
    S. W. Koh
    ,
    T. B. Lim
    DOI: 10.1115/1.1461367
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress modeling were performed. The hygroscopic stress induced through moisture conditioning was found to be significant compared to the thermal stress during solder reflow. Hygroscopic stress in over-molded wire bond PBGA and molded Flip Chip PBGA was found to be 1.3 times to 1.5 times that of thermal stress. Hygroscopic swelling of the underfill in FCPBGA was found to be the main failure driver during autoclave test. Autoclave performance of FCPBGA package assembled with different underfills and chips were analyzed. Excellent correlation was found between autoclave performance and the hygroscopic swelling characteristics of the underfills.
    keyword(s): Electronic packaging , Stress , Modeling , Packaging , Thermal stresses , Flip-chip , Diffusion (Physics) , Failure , Thickness AND Wire ,
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      The Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/126628
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    contributor authorE. H. Wong
    contributor authorR. Rajoo
    contributor authorS. W. Koh
    contributor authorT. B. Lim
    date accessioned2017-05-09T00:07:12Z
    date available2017-05-09T00:07:12Z
    date copyrightJune, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26203#122_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126628
    description abstractA reliable technique for characterizing the hygroscopic swelling of materials has been developed and used to characterize a number of packaging materials. Using these data, hygroscopic stress modeling were performed. The hygroscopic stress induced through moisture conditioning was found to be significant compared to the thermal stress during solder reflow. Hygroscopic stress in over-molded wire bond PBGA and molded Flip Chip PBGA was found to be 1.3 times to 1.5 times that of thermal stress. Hygroscopic swelling of the underfill in FCPBGA was found to be the main failure driver during autoclave test. Autoclave performance of FCPBGA package assembled with different underfills and chips were analyzed. Excellent correlation was found between autoclave performance and the hygroscopic swelling characteristics of the underfills.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Mechanics and Impact of Hygroscopic Swelling of Polymeric Materials in Electronic Packaging
    typeJournal Paper
    journal volume124
    journal issue2
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1461367
    journal fristpage122
    journal lastpage126
    identifier eissn1043-7398
    keywordsElectronic packaging
    keywordsStress
    keywordsModeling
    keywordsPackaging
    keywordsThermal stresses
    keywordsFlip-chip
    keywordsDiffusion (Physics)
    keywordsFailure
    keywordsThickness AND Wire
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
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    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian