Mechanical Modeling and Characterization of the Curing Process of Underfill MaterialsSource: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002::page 97Author:L. J. Ernst
,
G. Q. Zhang
,
H. J. L. Bressers
,
C. van ’t Hof
,
D. G. Yang
,
J. F. J. Caers
,
A. W. J. den Boer
,
M. S. Kiasat
,
J. Janssen
DOI: 10.1115/1.1459471Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations, under assumed operating conditions. Because of lacking insight into the mechanical processes due to polymer curing, the impact of processing induced residual stress fields is often neglected. To investigate the evolution of stress and strain fields during the curing process it is important to assume a more appropriate starting point for subsequent process modeling. Furthermore, study of possible damage originating from the fabrication process then comes within reach. To facilitate future analysis of stress and strain fields during the curing process a cure dependent constitutive relation is assumed. An approximate investigation method for the process-dependent mechanical properties, based on Dynamic Mechanic Analysis (DMA), is developed. As an illustration the parameter identification is performed for a selected epoxy resin.
keyword(s): Relaxation (Physics) , Stress , Shrinkage (Materials) , Curing , Modeling AND Shear (Mechanics) ,
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contributor author | L. J. Ernst | |
contributor author | G. Q. Zhang | |
contributor author | H. J. L. Bressers | |
contributor author | C. van ’t Hof | |
contributor author | D. G. Yang | |
contributor author | J. F. J. Caers | |
contributor author | A. W. J. den Boer | |
contributor author | M. S. Kiasat | |
contributor author | J. Janssen | |
date accessioned | 2017-05-09T00:07:12Z | |
date available | 2017-05-09T00:07:12Z | |
date copyright | June, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26203#97_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126624 | |
description abstract | Thermo-setting polymers are widely used as underfill materials to improve the reliability of electronic packages. In the design phase, the influence of underfill applications on reliability is often judged through thermal and mechanical simulations, under assumed operating conditions. Because of lacking insight into the mechanical processes due to polymer curing, the impact of processing induced residual stress fields is often neglected. To investigate the evolution of stress and strain fields during the curing process it is important to assume a more appropriate starting point for subsequent process modeling. Furthermore, study of possible damage originating from the fabrication process then comes within reach. To facilitate future analysis of stress and strain fields during the curing process a cure dependent constitutive relation is assumed. An approximate investigation method for the process-dependent mechanical properties, based on Dynamic Mechanic Analysis (DMA), is developed. As an illustration the parameter identification is performed for a selected epoxy resin. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Mechanical Modeling and Characterization of the Curing Process of Underfill Materials | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1459471 | |
journal fristpage | 97 | |
journal lastpage | 105 | |
identifier eissn | 1043-7398 | |
keywords | Relaxation (Physics) | |
keywords | Stress | |
keywords | Shrinkage (Materials) | |
keywords | Curing | |
keywords | Modeling AND Shear (Mechanics) | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 002 | |
contenttype | Fulltext |