| contributor author | D. Josell | |
| contributor author | A. C. Powell | |
| contributor author | W. E. Wallace | |
| contributor author | J. A. Warren | |
| contributor author | D. Wheeler | |
| date accessioned | 2017-05-09T00:07:11Z | |
| date available | 2017-05-09T00:07:11Z | |
| date copyright | September, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26206#227_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126616 | |
| description abstract | The results of wetting experiments between eutectic lead-tin solder and copper pads on silicon substrates in geometries relevant to flip-chip applications are presented. Measurements of solder joint dimensions, specifically stand-off height and lateral offset (i.e., misalignment), as functions of the applied force (normal and shear), solder volume and pad diameter are presented. The experimentally-measured force-displacement relationships are compared with predictions obtained from the minimum energy model of the Surface Evolver computer code. For the case of the axisymmetric joint (zero shear) an exact solution to the capillary equations is also presented. The comparison of experimental and modeling results indicates that such models are accurate as well as extremely sensitive means for predicting the geometry of these solder joints. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Misaligned Flip-Chip Solder Joints: Prediction and Experimental Determination of Force-Displacement Curves | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1463732 | |
| journal fristpage | 227 | |
| journal lastpage | 233 | |
| identifier eissn | 1043-7398 | |
| keywords | Force | |
| keywords | Solders | |
| keywords | Shear (Mechanics) | |
| keywords | Displacement | |
| keywords | Solder joints | |
| keywords | Flip-chip | |
| keywords | Modeling | |
| keywords | Wetting (Surface science) | |
| keywords | Geometry | |
| keywords | Measurement | |
| keywords | Copper AND Silicon | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003 | |
| contenttype | Fulltext | |