contributor author | Yunsheng Xu | |
contributor author | Xiangcheng Luo | |
contributor author | D. D. L. Chung | |
date accessioned | 2017-05-09T00:07:11Z | |
date available | 2017-05-09T00:07:11Z | |
date copyright | September, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26206#188_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126608 | |
description abstract | Polyethylene-glycol-based thermal interface paste containing trifluoroacetic acid lithium salt (1.5 wt. percent optimum) and boron nitride particles (∼18.0 vol. percent optimum), as well as water and N, N-dimethylformamide for helping the dissociation of the salt to release Li+ ions, gives thermal contact conductance that is almost as high as that given by Sn-Pb solder, similar to that given by boron nitride particle filled sodium silicate, and much higher than that given by boron nitride particle filled silicone. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Lithium Doped Polyethylene-Glycol-Based Thermal Interface Pastes for High Thermal Contact Conductance | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1477191 | |
journal fristpage | 188 | |
journal lastpage | 191 | |
identifier eissn | 1043-7398 | |
keywords | Ions | |
keywords | Particulate matter | |
keywords | Lithium | |
keywords | Contact resistance | |
keywords | Sodium | |
keywords | Silicones | |
keywords | Water AND Solders | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003 | |
contenttype | Fulltext | |