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    Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003::page 141
    Author:
    C. Q. Ru
    DOI: 10.1115/1.1481037
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: A simple non-local modified beam model is presented to evaluate interfacial thermal stresses in bimaterial elastic beams. The model has its root in an earlier model (Suhir 1986) which assumes that the longitudinal interfacial displacement at a point depends on the interfacial shear stress at that point. Different than that earlier local model, however, the present non-local model assumes that the longitudinal interfacial displacement at a point also depends on the second gradient of the interfacial shear stress at that point. The present model satisfies both the zero-longitudinal force and the zero-shear stress boundary conditions at the free edges, and the interfacial peeling stress given by the present model is self-equilibrated. Remarkably, the present model leads to a fourth-order differential equation for the interfacial shear stress, and is considerably simpler than other known modified beam models satisfying the abovementioned conditions. This desirable feature of the present model is believed to be significant especially when the model is applied to multilayered materials. In particular, the interfacial shear stress given by the present model is found to be in reasonably good agreement with some known numerical results.
    keyword(s): Stress , Shear (Mechanics) , Thermal stresses , Displacement AND Boundary-value problems ,
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      Interfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited

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    http://yetl.yabesh.ir/yetl1/handle/yetl/126601
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    contributor authorC. Q. Ru
    date accessioned2017-05-09T00:07:10Z
    date available2017-05-09T00:07:10Z
    date copyrightSeptember, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26206#141_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126601
    description abstractA simple non-local modified beam model is presented to evaluate interfacial thermal stresses in bimaterial elastic beams. The model has its root in an earlier model (Suhir 1986) which assumes that the longitudinal interfacial displacement at a point depends on the interfacial shear stress at that point. Different than that earlier local model, however, the present non-local model assumes that the longitudinal interfacial displacement at a point also depends on the second gradient of the interfacial shear stress at that point. The present model satisfies both the zero-longitudinal force and the zero-shear stress boundary conditions at the free edges, and the interfacial peeling stress given by the present model is self-equilibrated. Remarkably, the present model leads to a fourth-order differential equation for the interfacial shear stress, and is considerably simpler than other known modified beam models satisfying the abovementioned conditions. This desirable feature of the present model is believed to be significant especially when the model is applied to multilayered materials. In particular, the interfacial shear stress given by the present model is found to be in reasonably good agreement with some known numerical results.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleInterfacial Thermal Stresses in Bimaterial Elastic Beams: Modified Beam Models Revisited
    typeJournal Paper
    journal volume124
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1481037
    journal fristpage141
    journal lastpage146
    identifier eissn1043-7398
    keywordsStress
    keywordsShear (Mechanics)
    keywordsThermal stresses
    keywordsDisplacement AND Boundary-value problems
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 003
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
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