YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

    Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004::page 328
    Author:
    John E. Ritter
    ,
    G. S. Jacome
    ,
    J. R. Pelch
    ,
    T. P. Russell
    ,
    T. J. Lardner
    DOI: 10.1115/1.1503064
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The resistance of silane bonded epoxy/glass interfaces to subcritical crack growth was studied as a function of the density of primary bonds between the silane and epoxy using the double-cleavage drilled compression test (DCDC). The silane coupling agents propyltriethoxysilane (PES), 3-aminopropyltriethoxysilane (3-APES) and various mixtures of 3-APES and PES were used to systematically control the bonding density since 3-APES can form primary bonds with both the glass and the epoxy, while PES forms primary bonds only with the glass. The resistance of these interfaces to crack growth was tested under both static and cyclic loading in high and low humidity test environments. These tests allowed the separation of the effects on crack growth due to stress corrosion and cyclic fatigue. Experimental results showed that the density of primary bonding between the silane layer and the epoxy controls the cyclic fatigue resistance of the silanized interfaces. Additionally, for 3-APES bonded epoxy/glass interfaces cyclic fatigue crack growth predominates at both high and low humidities but for PES bonded interfaces, crack growth by stress corrosion dominates at high humidity and by cyclic fatigue at low humidities. For a 50% 3-APES/50% PES bonded interface, stress corrosion effects are somewhat greater than cyclic fatigue effects at high humidities but at low humidities the two effects are comparable. When testing the interfaces for durability, PES bonded interfaces showed spontaneous delamination when aged in distilled water for 36h at 94°C. On the other hand, 3-APES and mixtures of 3-APES bonded interfaces did not show any detrimental effect of the cyclic fatigue resistance when aged in distilled water at temperatures up to 98°C.
    keyword(s): Fatigue , Glass , Electrical resistance , Epoxy adhesives , Fracture (Materials) , Stress corrosion cracking , Water , Fatigue cracks , Bonding AND Mixtures ,
    • Download: (157.2Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/126576
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorJohn E. Ritter
    contributor authorG. S. Jacome
    contributor authorJ. R. Pelch
    contributor authorT. P. Russell
    contributor authorT. J. Lardner
    date accessioned2017-05-09T00:07:08Z
    date available2017-05-09T00:07:08Z
    date copyrightDecember, 2002
    date issued2002
    identifier issn1528-9044
    identifier otherJEPAE4-26210#328_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/126576
    description abstractThe resistance of silane bonded epoxy/glass interfaces to subcritical crack growth was studied as a function of the density of primary bonds between the silane and epoxy using the double-cleavage drilled compression test (DCDC). The silane coupling agents propyltriethoxysilane (PES), 3-aminopropyltriethoxysilane (3-APES) and various mixtures of 3-APES and PES were used to systematically control the bonding density since 3-APES can form primary bonds with both the glass and the epoxy, while PES forms primary bonds only with the glass. The resistance of these interfaces to crack growth was tested under both static and cyclic loading in high and low humidity test environments. These tests allowed the separation of the effects on crack growth due to stress corrosion and cyclic fatigue. Experimental results showed that the density of primary bonding between the silane layer and the epoxy controls the cyclic fatigue resistance of the silanized interfaces. Additionally, for 3-APES bonded epoxy/glass interfaces cyclic fatigue crack growth predominates at both high and low humidities but for PES bonded interfaces, crack growth by stress corrosion dominates at high humidity and by cyclic fatigue at low humidities. For a 50% 3-APES/50% PES bonded interface, stress corrosion effects are somewhat greater than cyclic fatigue effects at high humidities but at low humidities the two effects are comparable. When testing the interfaces for durability, PES bonded interfaces showed spontaneous delamination when aged in distilled water for 36h at 94°C. On the other hand, 3-APES and mixtures of 3-APES bonded interfaces did not show any detrimental effect of the cyclic fatigue resistance when aged in distilled water at temperatures up to 98°C.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleControlling Subcritical Crack Growth at Epoxy/Glass Interfaces
    typeJournal Paper
    journal volume124
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1503064
    journal fristpage328
    journal lastpage333
    identifier eissn1043-7398
    keywordsFatigue
    keywordsGlass
    keywordsElectrical resistance
    keywordsEpoxy adhesives
    keywordsFracture (Materials)
    keywordsStress corrosion cracking
    keywordsWater
    keywordsFatigue cracks
    keywordsBonding AND Mixtures
    treeJournal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian