contributor author | John E. Ritter | |
contributor author | G. S. Jacome | |
contributor author | J. R. Pelch | |
contributor author | T. P. Russell | |
contributor author | T. J. Lardner | |
date accessioned | 2017-05-09T00:07:08Z | |
date available | 2017-05-09T00:07:08Z | |
date copyright | December, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26210#328_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126576 | |
description abstract | The resistance of silane bonded epoxy/glass interfaces to subcritical crack growth was studied as a function of the density of primary bonds between the silane and epoxy using the double-cleavage drilled compression test (DCDC). The silane coupling agents propyltriethoxysilane (PES), 3-aminopropyltriethoxysilane (3-APES) and various mixtures of 3-APES and PES were used to systematically control the bonding density since 3-APES can form primary bonds with both the glass and the epoxy, while PES forms primary bonds only with the glass. The resistance of these interfaces to crack growth was tested under both static and cyclic loading in high and low humidity test environments. These tests allowed the separation of the effects on crack growth due to stress corrosion and cyclic fatigue. Experimental results showed that the density of primary bonding between the silane layer and the epoxy controls the cyclic fatigue resistance of the silanized interfaces. Additionally, for 3-APES bonded epoxy/glass interfaces cyclic fatigue crack growth predominates at both high and low humidities but for PES bonded interfaces, crack growth by stress corrosion dominates at high humidity and by cyclic fatigue at low humidities. For a 50% 3-APES/50% PES bonded interface, stress corrosion effects are somewhat greater than cyclic fatigue effects at high humidities but at low humidities the two effects are comparable. When testing the interfaces for durability, PES bonded interfaces showed spontaneous delamination when aged in distilled water for 36h at 94°C. On the other hand, 3-APES and mixtures of 3-APES bonded interfaces did not show any detrimental effect of the cyclic fatigue resistance when aged in distilled water at temperatures up to 98°C. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Controlling Subcritical Crack Growth at Epoxy/Glass Interfaces | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1503064 | |
journal fristpage | 328 | |
journal lastpage | 333 | |
identifier eissn | 1043-7398 | |
keywords | Fatigue | |
keywords | Glass | |
keywords | Electrical resistance | |
keywords | Epoxy adhesives | |
keywords | Fracture (Materials) | |
keywords | Stress corrosion cracking | |
keywords | Water | |
keywords | Fatigue cracks | |
keywords | Bonding AND Mixtures | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
contenttype | Fulltext | |