Transient Thermal Management of a Handset Using Phase Change Material (PCM)Source: Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004::page 419Author:Marc Hodes
,
Randy D. Weinstein
,
Lou Manzione
,
Calvin Chen
,
Stephen J. Pence
,
Jason M. Piccini
DOI: 10.1115/1.1523061Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined.
keyword(s): Temperature , Heat transfer , Radiation (Physics) , Phase change materials , Steady state , Thermal management , Thermocouples , Heat AND Natural convection ,
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contributor author | Marc Hodes | |
contributor author | Randy D. Weinstein | |
contributor author | Lou Manzione | |
contributor author | Calvin Chen | |
contributor author | Stephen J. Pence | |
contributor author | Jason M. Piccini | |
date accessioned | 2017-05-09T00:07:08Z | |
date available | 2017-05-09T00:07:08Z | |
date copyright | December, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26210#419_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126571 | |
description abstract | The power density of portable electronic devices continues to increase because packaging advances reduce their size even as features are added and enhanced. Designing thermal management systems to accommodate steady-state conditions as opposed to fixed duty cycles can substantially increase cost, size, and weight. The feasibility of transient thermal management of handsets using phase change materials (PCMs) was experimentally investigated using an ABS handset mock-up. At selected intervals of time, the nonuniform case temperature of the handset was measured using an infrared (IR) camera, while thermocouples measured the temperatures of the PCM and simulated power amplifier (heater). Transient and steady-state heat transfer rates by natural convective and radiation from the handset to the environment were numerically computed from the temperature data in the thermal images. The effects of PCM material, power supplied to the handset, and handset orientation on the time required for the handset case to reach a given (maximum) temperature and “recovery” time were examined. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Transient Thermal Management of a Handset Using Phase Change Material (PCM) | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1523061 | |
journal fristpage | 419 | |
journal lastpage | 426 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Radiation (Physics) | |
keywords | Phase change materials | |
keywords | Steady state | |
keywords | Thermal management | |
keywords | Thermocouples | |
keywords | Heat AND Natural convection | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
contenttype | Fulltext |