| contributor author | J. Lau | |
| contributor author | Z. Mei | |
| contributor author | S. Pang | |
| contributor author | C. Amsden | |
| contributor author | J. Rayner | |
| contributor author | S. Pan | |
| date accessioned | 2017-05-09T00:07:08Z | |
| date available | 2017-05-09T00:07:08Z | |
| date copyright | December, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26210#403_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126569 | |
| description abstract | Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1512294 | |
| journal fristpage | 403 | |
| journal lastpage | 410 | |
| identifier eissn | 1043-7398 | |
| keywords | Solders | |
| keywords | Sealing (Process) | |
| keywords | Stress | |
| keywords | Creep | |
| keywords | Fatigue | |
| keywords | Cycles | |
| keywords | Switches | |
| keywords | Fatigue testing | |
| keywords | molybdenum | |
| keywords | Silicon chips | |
| keywords | Temperature AND Density | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
| contenttype | Fulltext | |