contributor author | J. Lau | |
contributor author | Z. Mei | |
contributor author | S. Pang | |
contributor author | C. Amsden | |
contributor author | J. Rayner | |
contributor author | S. Pan | |
date accessioned | 2017-05-09T00:07:08Z | |
date available | 2017-05-09T00:07:08Z | |
date copyright | December, 2002 | |
date issued | 2002 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26210#403_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126569 | |
description abstract | Thermal reliability of the solder sealing ring of Agilent Technologies’ bubble-actuated photonic cross-connect switches has been investigated in this paper. Emphasis is placed on the determination of the thermal-fatigue life of the solder sealing ring under shipping/storing/handling conditions. The solder ring is assumed to obey the Garofalo-Arrhenius creep constitutive law. The nonlinear responses such as the deflections, stresses, creep strains, and creep strain energy density of the 3-D photonic package have been determined with a commercial finite element code. In addition, isothermal fatigue tests have been performed to obtain the relationship between the number of cycle-to-failure and the strain energy density. Thus, by combining the finite element results and the isothermal fatigue test results, the average thermal-fatigue life of the solder sealing ring is readily determined and is found to be more than adequate for shipping/storing/handling the photonic switches. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Creep Analysis and Thermal-Fatigue Life Prediction of the Lead-Free Solder Sealing Ring of a Photonic Switch | |
type | Journal Paper | |
journal volume | 124 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1512294 | |
journal fristpage | 403 | |
journal lastpage | 410 | |
identifier eissn | 1043-7398 | |
keywords | Solders | |
keywords | Sealing (Process) | |
keywords | Stress | |
keywords | Creep | |
keywords | Fatigue | |
keywords | Cycles | |
keywords | Switches | |
keywords | Fatigue testing | |
keywords | molybdenum | |
keywords | Silicon chips | |
keywords | Temperature AND Density | |
tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
contenttype | Fulltext | |