| contributor author | R. L. Mahajan | |
| contributor author | C. P. Malhotra | |
| contributor author | R. K. Sharma | |
| date accessioned | 2017-05-09T00:07:08Z | |
| date available | 2017-05-09T00:07:08Z | |
| date copyright | December, 2002 | |
| date issued | 2002 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26210#391_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/126566 | |
| description abstract | An analytical model relating the degree of cure of an underfill epoxy to the heat transfer coefficient of the heating process and time is presented. The model was verified experimentally by partially curing samples of a commercial underfill epoxy in two different heating environments for various times and scanning the samples in a differential scanning calorimeter to determine the degree of cure. A simplified equation can be used to relate the time required to achieve a given degree of cure to the heat transfer coefficient and the isothermal cure time. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | An Analytical Cure Model for Underfill Epoxies | |
| type | Journal Paper | |
| journal volume | 124 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1510864 | |
| journal fristpage | 391 | |
| journal lastpage | 396 | |
| identifier eissn | 1043-7398 | |
| keywords | Epoxy adhesives | |
| keywords | Curing | |
| keywords | Equations | |
| keywords | Heating AND Heat transfer coefficients | |
| tree | Journal of Electronic Packaging:;2002:;volume( 124 ):;issue: 004 | |
| contenttype | Fulltext | |