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    Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001::page 74
    Author:
    Y.-L. Shen
    ,
    H. E. Fang
    ,
    W. Li
    DOI: 10.1115/1.1324673
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic tin-lead alloy was undertaken using the finite element method. The models consist of regularly arranged tin-rich and lead-rich phases, simulating the lamellar array and colony structure in a typical eutectic system. A fine structure and a coarse structure, bearing the same phase fraction but different in the aspect ratio of each lead-rich layer and in the number of lead-rich layers in each colony, are utilized for representing the microstructure before and after coarsening, respectively. Both phases are treated as elastic–plastic solids with their respective properties. For simplicity the creep effect is ignored without compromising the main objective of this study. Cyclic loading under pure shear and uniaxial conditions is modeled. It is found that both the fine and coarse structures exhibit essentially the same macroscopic stress–strain response. The coarse structure, however, shows a greater maximum effective plastic strain on a local scale throughout the deformation. The numerical result implies that, in a solder joint, a locally coarsened region may not be mechanically weaker than its surrounding, but it is subject to early damage initiation due to accumulated plasticity. Other implications regarding solder alloy failure and micromechanical modeling of two-phase materials are discussed.
    keyword(s): Deformation , Alloys , Stress , Shear (Mechanics) , Plasticity , Numerical analysis , Modeling , Solder joints , Failure , Creep , Solders , Fatigue AND Solids ,
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      Phase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125069
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    contributor authorY.-L. Shen
    contributor authorH. E. Fang
    contributor authorW. Li
    date accessioned2017-05-09T00:04:38Z
    date available2017-05-09T00:04:38Z
    date copyrightMarch, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26189#74_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125069
    description abstractThis study is devoted to providing a mechanistic rationale of coarsening induced failure in solder alloys during thermomechanical fatigue. Micromechanical modeling of cyclic deformation of eutectic tin-lead alloy was undertaken using the finite element method. The models consist of regularly arranged tin-rich and lead-rich phases, simulating the lamellar array and colony structure in a typical eutectic system. A fine structure and a coarse structure, bearing the same phase fraction but different in the aspect ratio of each lead-rich layer and in the number of lead-rich layers in each colony, are utilized for representing the microstructure before and after coarsening, respectively. Both phases are treated as elastic–plastic solids with their respective properties. For simplicity the creep effect is ignored without compromising the main objective of this study. Cyclic loading under pure shear and uniaxial conditions is modeled. It is found that both the fine and coarse structures exhibit essentially the same macroscopic stress–strain response. The coarse structure, however, shows a greater maximum effective plastic strain on a local scale throughout the deformation. The numerical result implies that, in a solder joint, a locally coarsened region may not be mechanically weaker than its surrounding, but it is subject to early damage initiation due to accumulated plasticity. Other implications regarding solder alloy failure and micromechanical modeling of two-phase materials are discussed.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePhase Structure and Cyclic Deformation in Eutectic Tin-Lead Alloy: A Numerical Analysis
    typeJournal Paper
    journal volume123
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1324673
    journal fristpage74
    journal lastpage78
    identifier eissn1043-7398
    keywordsDeformation
    keywordsAlloys
    keywordsStress
    keywordsShear (Mechanics)
    keywordsPlasticity
    keywordsNumerical analysis
    keywordsModeling
    keywordsSolder joints
    keywordsFailure
    keywordsCreep
    keywordsSolders
    keywordsFatigue AND Solids
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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