| contributor author | Reena Cole | |
| contributor author | Tara Dalton | |
| contributor author | Jeff Punch | |
| contributor author | Mark R. Davies | |
| contributor author | Ronan Grimes | |
| date accessioned | 2017-05-09T00:04:36Z | |
| date available | 2017-05-09T00:04:36Z | |
| date copyright | June, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26192#120_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125049 | |
| description abstract | The case is made for the continued use of single valued thermal resistances for the prediction of component junction temperature, and, hence, reliability. These values are adjusted using empirically determined influence factors to account for thermal and aerodynamic interactions at board level. The paper presents measured values of influence factors for arrays of Plastic Quad Flat Packs (PQFPs) over a range of Reynolds numbers and with a series of board level obstacles modeling upstream passive components. The results are formulated into a novel set of design rules. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Forced Convection Board Level Thermal Design Methodology for Electronic Systems | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1339822 | |
| journal fristpage | 120 | |
| journal lastpage | 126 | |
| identifier eissn | 1043-7398 | |
| keywords | Temperature | |
| keywords | Reynolds number | |
| keywords | Engineering standards | |
| keywords | Design | |
| keywords | Design methodology | |
| keywords | Forced convection | |
| keywords | Electronic systems | |
| keywords | Junctions | |
| keywords | Thermal resistance | |
| keywords | Flow (Dynamics) | |
| keywords | Velocity AND Vehicles | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 002 | |
| contenttype | Fulltext | |