| contributor author | G. Z. Wang | |
| contributor author | K. Becker | |
| contributor author | J. Wilde | |
| contributor author | Z. N. Cheng | |
| date accessioned | 2017-05-09T00:04:35Z | |
| date available | 2017-05-09T00:04:35Z | |
| date copyright | September, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26195#247_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125036 | |
| description abstract | A unified viscoplastic constitutive law, the Anand model, was applied to represent the inelastic deformation behavior for solders used in electronic packaging. The material parameters of the constitutive relations for 62Sn36Pb2Ag, 60Sn40Pb, 96.5Sn3.5Ag, and 97.5Pb2.5Sn solders were determined from separated constitutive relations and experimental results. The achieved unified Anand model for solders were tested for constant strain rate testing, steady-state plastic flow and stress/strain responses under cyclic loading. It is concluded that the Anand model can be applied for representing the inelastic deformation behavior of solders at high homologous temperature and can be recommended for finite element simulation of the stress/strain responses of solder joints in service. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Applying Anand Model to Represent the Viscoplastic Deformation Behavior of Solder Alloys | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1371781 | |
| journal fristpage | 247 | |
| journal lastpage | 253 | |
| identifier eissn | 1043-7398 | |
| keywords | Deformation | |
| keywords | Creep | |
| keywords | Temperature | |
| keywords | Alloys | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Steady state | |
| keywords | Solder joints | |
| keywords | Constitutive equations AND Finite element analysis | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
| contenttype | Fulltext | |