A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic PackagesSource: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003::page 200DOI: 10.1115/1.1348337Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper introduces a general computational model for electronic packages, e.g., cabinets that contain electronic equipment. A simplified physical model, which combines principles of classical thermodynamics and heat transfer, is developed and the resulting three-dimensional differential equations are discretized in space using a three-dimensional cell centered finite volume scheme. Therefore, the combination of the proposed simplified physical model with the adopted finite volume scheme for the numerical discretization of the differential equations is called a volume element model (VEM). A typical cabinet was built in the laboratory, and two different experimental conditions were tested, measuring the temperatures at forty-six internal points. The proposed model was utilized to simulate numerically the behavior of the cabinet operating under the same experimental conditions. Mesh refinements were conducted to ensure the convergence of the numerical results. The converged mesh was relatively coarse (504 cells), therefore the solutions were obtained with low computational time. The model temperature results were directly compared to the steady-state experimental measurements of the forty-six internal points, with good quantitative and qualitative agreement. Since accuracy and low computational time are combined, the model is shown to be efficient and could be used as a tool for simulation, design, and optimization of electronic packages.
keyword(s): Heat , Temperature , Electronic packages , Optimization , Heat transfer , Computer simulation , Heat flux AND Electronic equipment ,
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contributor author | J. V. C. Vargas | |
contributor author | M. C. Campos | |
contributor author | G. Stanescu | |
contributor author | R. Florea | |
date accessioned | 2017-05-09T00:04:35Z | |
date available | 2017-05-09T00:04:35Z | |
date copyright | September, 2001 | |
date issued | 2001 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26195#200_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125029 | |
description abstract | This paper introduces a general computational model for electronic packages, e.g., cabinets that contain electronic equipment. A simplified physical model, which combines principles of classical thermodynamics and heat transfer, is developed and the resulting three-dimensional differential equations are discretized in space using a three-dimensional cell centered finite volume scheme. Therefore, the combination of the proposed simplified physical model with the adopted finite volume scheme for the numerical discretization of the differential equations is called a volume element model (VEM). A typical cabinet was built in the laboratory, and two different experimental conditions were tested, measuring the temperatures at forty-six internal points. The proposed model was utilized to simulate numerically the behavior of the cabinet operating under the same experimental conditions. Mesh refinements were conducted to ensure the convergence of the numerical results. The converged mesh was relatively coarse (504 cells), therefore the solutions were obtained with low computational time. The model temperature results were directly compared to the steady-state experimental measurements of the forty-six internal points, with good quantitative and qualitative agreement. Since accuracy and low computational time are combined, the model is shown to be efficient and could be used as a tool for simulation, design, and optimization of electronic packages. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | A Numerical Model to Predict the Thermal and Psychrometric Response of Electronic Packages | |
type | Journal Paper | |
journal volume | 123 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1348337 | |
journal fristpage | 200 | |
journal lastpage | 210 | |
identifier eissn | 1043-7398 | |
keywords | Heat | |
keywords | Temperature | |
keywords | Electronic packages | |
keywords | Optimization | |
keywords | Heat transfer | |
keywords | Computer simulation | |
keywords | Heat flux AND Electronic equipment | |
tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
contenttype | Fulltext |