| contributor author | Calvin Chen | |
| contributor author | Marc Hodes | |
| contributor author | Lou Manzione | |
| date accessioned | 2017-05-09T00:04:35Z | |
| date available | 2017-05-09T00:04:35Z | |
| date copyright | September, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26195#173_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125025 | |
| description abstract | A means to properly size rectangular heat spreaders between a dielectric layer connected to thermal ground and a power device is developed by modeling the problem as a thermal resistance network. Generalized formulas and nondimensional charts to optimize heat spreader thickness and footprint are presented. The power device and heat spreader are assumed to be (concentric) rectangular solids of arbitrary length, width and thickness. The nondimensional results are validated by finite element analysis (FEA) and examples demonstrate the utility of the methodology to thermal design engineers. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Sizing of Heat Spreaders Above Dielectric Layers | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1377271 | |
| journal fristpage | 173 | |
| journal lastpage | 181 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal resistance | |
| keywords | Flat heat pipes | |
| keywords | Thickness | |
| keywords | Networks | |
| keywords | Electrical resistance | |
| keywords | Heat | |
| keywords | Finite element analysis AND Heat conduction | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 003 | |
| contenttype | Fulltext | |