contributor author | Katsuhiko Sasaki | |
contributor author | Ken-ichi Ohguchi | |
contributor author | Research Associate | |
contributor author | Hiromasa Ishikawa | |
date accessioned | 2017-05-09T00:04:33Z | |
date available | 2017-05-09T00:04:33Z | |
date copyright | December, 2001 | |
date issued | 2001 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26198#379_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125007 | |
description abstract | This study first proposes a simple constitutive model for viscoplasticity, which includes the elastic, plastic, and creep strains independently. The plastic strain is evaluated by the flow rule employing back stresses evolved with a Ziegler type of hardening rule. The creep strain is evaluated by the modified Norton’s law. The applicability of this constitutive model is evaluated with pure tensile tests, creep tests and cyclic tension-compression loading tests, to demonstrate the progress of viscoplastic deformation of 40Pb/60Sn solder alloys. The tests were conducted over both several temperature ranges and strain rates. As a result, it was found that the material constants used in the constitutive model could be determined by simple tests such as pure tensile and cyclic tension-compression loading tests. The simulation by the constitutive model explains accurately the viscoplastic deformation of the 40Pb/60Sn solder alloys. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling | |
type | Journal Paper | |
journal volume | 123 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1371927 | |
journal fristpage | 379 | |
journal lastpage | 387 | |
identifier eissn | 1043-7398 | |
keywords | Deformation | |
keywords | Creep | |
keywords | Temperature | |
keywords | Alloys | |
keywords | Solders | |
keywords | Stress | |
keywords | Constitutive equations | |
keywords | Compression | |
keywords | Tension | |
keywords | Engineering simulation | |
keywords | Modeling | |
keywords | Flow (Dynamics) | |
keywords | Stress-strain relations AND Simulation | |
tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
contenttype | Fulltext | |