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    Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

    Source: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004::page 379
    Author:
    Katsuhiko Sasaki
    ,
    Ken-ichi Ohguchi
    ,
    Research Associate
    ,
    Hiromasa Ishikawa
    DOI: 10.1115/1.1371927
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This study first proposes a simple constitutive model for viscoplasticity, which includes the elastic, plastic, and creep strains independently. The plastic strain is evaluated by the flow rule employing back stresses evolved with a Ziegler type of hardening rule. The creep strain is evaluated by the modified Norton’s law. The applicability of this constitutive model is evaluated with pure tensile tests, creep tests and cyclic tension-compression loading tests, to demonstrate the progress of viscoplastic deformation of 40Pb/60Sn solder alloys. The tests were conducted over both several temperature ranges and strain rates. As a result, it was found that the material constants used in the constitutive model could be determined by simple tests such as pure tensile and cyclic tension-compression loading tests. The simulation by the constitutive model explains accurately the viscoplastic deformation of the 40Pb/60Sn solder alloys.
    keyword(s): Deformation , Creep , Temperature , Alloys , Solders , Stress , Constitutive equations , Compression , Tension , Engineering simulation , Modeling , Flow (Dynamics) , Stress-strain relations AND Simulation ,
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      Viscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling

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    http://yetl.yabesh.ir/yetl1/handle/yetl/125007
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    contributor authorKatsuhiko Sasaki
    contributor authorKen-ichi Ohguchi
    contributor authorResearch Associate
    contributor authorHiromasa Ishikawa
    date accessioned2017-05-09T00:04:33Z
    date available2017-05-09T00:04:33Z
    date copyrightDecember, 2001
    date issued2001
    identifier issn1528-9044
    identifier otherJEPAE4-26198#379_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/125007
    description abstractThis study first proposes a simple constitutive model for viscoplasticity, which includes the elastic, plastic, and creep strains independently. The plastic strain is evaluated by the flow rule employing back stresses evolved with a Ziegler type of hardening rule. The creep strain is evaluated by the modified Norton’s law. The applicability of this constitutive model is evaluated with pure tensile tests, creep tests and cyclic tension-compression loading tests, to demonstrate the progress of viscoplastic deformation of 40Pb/60Sn solder alloys. The tests were conducted over both several temperature ranges and strain rates. As a result, it was found that the material constants used in the constitutive model could be determined by simple tests such as pure tensile and cyclic tension-compression loading tests. The simulation by the constitutive model explains accurately the viscoplastic deformation of the 40Pb/60Sn solder alloys.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleViscoplastic Deformation of 40 Pb/60Sn Solder Alloys—Experiments and Constitutive Modeling
    typeJournal Paper
    journal volume123
    journal issue4
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1371927
    journal fristpage379
    journal lastpage387
    identifier eissn1043-7398
    keywordsDeformation
    keywordsCreep
    keywordsTemperature
    keywordsAlloys
    keywordsSolders
    keywordsStress
    keywordsConstitutive equations
    keywordsCompression
    keywordsTension
    keywordsEngineering simulation
    keywordsModeling
    keywordsFlow (Dynamics)
    keywordsStress-strain relations AND Simulation
    treeJournal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004
    contenttypeFulltext
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