Thermal Math Modeling and Analysis of an Electronic AssemblySource: Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004::page 372Author:K. N. Shukla
DOI: 10.1115/1.1388561Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function.
keyword(s): Heat , Temperature , Manufacturing , Finite element methods , Modeling , Flat plates , Temperature distribution , Thermal analysis , Circuits , Heat transfer coefficients , Boundary-value problems , Equations AND Transistors ,
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| contributor author | K. N. Shukla | |
| date accessioned | 2017-05-09T00:04:33Z | |
| date available | 2017-05-09T00:04:33Z | |
| date copyright | December, 2001 | |
| date issued | 2001 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26198#372_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125006 | |
| description abstract | This paper presents a mathematical model for a three-dimensional thermal analysis of a circuit board with multiple heat dissipating sources. The model considers the three-dimensional flat plate with discrete surface heat sources and integral transform technique is employed to determine the temperature distribution. The calculation procedure for the thermal characteristics of a circuit board, with surface mounted components, is presented and the solution is compared with those obtained from the finite element method. Also, the temperature distribution of a two-layered circuit board is presented in terms of Green’s function. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermal Math Modeling and Analysis of an Electronic Assembly | |
| type | Journal Paper | |
| journal volume | 123 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.1388561 | |
| journal fristpage | 372 | |
| journal lastpage | 378 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat | |
| keywords | Temperature | |
| keywords | Manufacturing | |
| keywords | Finite element methods | |
| keywords | Modeling | |
| keywords | Flat plates | |
| keywords | Temperature distribution | |
| keywords | Thermal analysis | |
| keywords | Circuits | |
| keywords | Heat transfer coefficients | |
| keywords | Boundary-value problems | |
| keywords | Equations AND Transistors | |
| tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
| contenttype | Fulltext |