contributor author | Dagmar Beyerlein | |
contributor author | Lee E. Hornberger | |
date accessioned | 2017-05-09T00:04:33Z | |
date available | 2017-05-09T00:04:33Z | |
date copyright | December, 2001 | |
date issued | 2001 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26198#366_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/125005 | |
description abstract | Reducing integrated circuit (IC) plastic packaging production costs by improving the transfer mold and leadframe designs is a costly and time-consuming process. Rather than building mold and leadframe prototypes to perform empirical studies, this research describes how C-MOLD, a microchip encapsulation simulation software application, was used to validate and optimize an innovative mold and leadframe design that has the potential to reduce raw material waste associated with packaging by more than 59 percent. Estimates indicate that the proposed design will cut annual production costs by more than $600,000. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Using Computer Simulation to Validate and Optimize the Design of an Innovative Electronic Packaging Concept | |
type | Journal Paper | |
journal volume | 123 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1388562 | |
journal fristpage | 366 | |
journal lastpage | 371 | |
identifier eissn | 1043-7398 | |
keywords | Flow (Dynamics) | |
keywords | Temperature | |
keywords | Wire | |
keywords | Simulation | |
keywords | Molding | |
keywords | Design | |
keywords | Cavities | |
keywords | Computer software | |
keywords | Integrated circuits | |
keywords | Resins | |
keywords | Electronic packaging | |
keywords | Gates (Closures) | |
keywords | Engineering simulation | |
keywords | Computer simulation | |
keywords | Force | |
keywords | Deformation AND Viscosity | |
tree | Journal of Electronic Packaging:;2001:;volume( 123 ):;issue: 004 | |
contenttype | Fulltext | |