| contributor author | John H. Lau | |
| contributor author | S. W. Ricky Lee | |
| date accessioned | 2017-05-09T00:02:13Z | |
| date available | 2017-05-09T00:02:13Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#34_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123574 | |
| description abstract | The popcorning effect of plastic ball grid array (PBGA) packages is analyzed using the method of fracture mechanics. The following three specific problems are studied: (1) crack initiation in the die attach of the package, (2) crack growth in the die attach, and (3) crack growth at the interface between the solder mask and copper. Two different methods (crack tip opening displacement and virtual crack closure technique) are used to determine the crack-tip parameters such as the strain energy release rate, stress intensity factors, and phase angle for different crack lengths and temperatures. [S1043-7398(00)00401-1] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Temperature-Dependent Popcorning Analysis of Plastic Ball Grid Array Package During Solder Reflow With Fracture Mechanics Method | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483129 | |
| journal fristpage | 34 | |
| journal lastpage | 41 | |
| identifier eissn | 1043-7398 | |
| keywords | Thermal expansion | |
| keywords | Fracture mechanics | |
| keywords | Temperature | |
| keywords | Copper | |
| keywords | Solders | |
| keywords | Stress | |
| keywords | Fracture (Materials) | |
| keywords | Masks | |
| keywords | Reflow soldering | |
| keywords | Ball-Grid-Array packaging AND Pressure | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext | |
