| contributor author | Sejin Han | |
| contributor author | K. K. Wang | |
| date accessioned | 2017-05-09T00:02:13Z | |
| date available | 2017-05-09T00:02:13Z | |
| date copyright | March, 2000 | |
| date issued | 2000 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26178#20_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123572 | |
| description abstract | In this paper, flow during the filling and post-filling stages in semiconductor chip encapsulation has been analyzed. A finite-element method based on the Hele-Shaw approximation is used for the flow analysis in the chip cavity. The compressibility of the epoxy-molding compound has been considered to analyze the post-filling stage. The model has been verified by comparing resulting predictions with experimental results. Specifically, pressure has been measured in a rectangular cavity and compared with simulation results. The calculated and experimental results show good agreement. [S1043-7398(00)00101-8] | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Integrated Flow Analysis During Filling and Post-Filling Stage of Semiconductor Encapsulation | |
| type | Journal Paper | |
| journal volume | 122 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.483127 | |
| journal fristpage | 20 | |
| journal lastpage | 27 | |
| identifier eissn | 1043-7398 | |
| keywords | Flow (Dynamics) | |
| keywords | Temperature | |
| keywords | Semiconductors (Materials) | |
| keywords | Viscosity | |
| keywords | Packing (Shipments) | |
| keywords | Molding | |
| keywords | Pressure | |
| keywords | Cavities | |
| keywords | Equations | |
| keywords | Compressibility | |
| keywords | Epoxy adhesives | |
| keywords | Approximation | |
| keywords | Density AND Curing | |
| tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 001 | |
| contenttype | Fulltext | |
