contributor author | L. Nguyen | |
contributor author | S. Bayyuk | |
contributor author | S. A. Bidstrup-Allen | |
contributor author | S.-T. Wang | |
contributor author | C. Quentin | |
contributor author | W. Lee | |
date accessioned | 2017-05-09T00:02:12Z | |
date available | 2017-05-09T00:02:12Z | |
date copyright | June, 2000 | |
date issued | 2000 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26181#138_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123560 | |
description abstract | This paper presents, discusses, and compares results from experimental and computational studies of the plastic encapsulation process for a 144-lead TQFP package. The experimental results were obtained using an instrumented molding press, while the computational predictions were obtained using a newly-developed software for modeling transfer molding processes. Validation of the software is emphasized, and this was done mainly by comparing the computational results with the corresponding experimental measurements for pressure, temperature, and flow front advancement in the cavities and runners. The experimental and computational results were found to be in good agreement, especially for the flow-front shapes and locations. [S1043-7398(00)00502-8] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Computational Modeling and Validation of the Encapsulation of Plastic Packages by Transfer Molding | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.483146 | |
journal fristpage | 138 | |
journal lastpage | 146 | |
identifier eissn | 1043-7398 | |
keywords | Computer simulation | |
keywords | Simulation | |
keywords | Molding | |
keywords | Flow (Dynamics) | |
keywords | Temperature | |
keywords | Engineering simulation | |
keywords | Cavities | |
keywords | Project tasks | |
keywords | Transfer molding | |
keywords | Viscosity | |
keywords | Computer software | |
keywords | Pressure | |
keywords | Materials properties | |
keywords | Modeling AND Locations | |
tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 002 | |
contenttype | Fulltext | |