YaBeSH Engineering and Technology Library

    • Journals
    • PaperQuest
    • YSE Standards
    • YaBeSH
    • Login
    View Item 
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    •   YE&T Library
    • ASME
    • Journal of Electronic Packaging
    • View Item
    • All Fields
    • Source Title
    • Year
    • Publisher
    • Title
    • Subject
    • Author
    • DOI
    • ISBN
    Advanced Search
    JavaScript is disabled for your browser. Some features of this site may not work without it.

    Archive

    Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

    Source: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003::page 233
    Author:
    J. R. Culham
    ,
    Associate Professor and Director
    ,
    T. F. Lemczyk
    ,
    Project Engineer
    ,
    M. M. Yovanovich
    ,
    Professor Emeritus and Principal Scientific Advisor
    DOI: 10.1115/1.1287928
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1]
    keyword(s): Temperature , Boundary-value problems , Fourier series , Electronic packages , Thermal characterization , Cavities , Equations , Multi-chip modules , Modeling AND Heat ,
    • Download: (268.5Kb)
    • Show Full MetaData Hide Full MetaData
    • Get RIS
    • Item Order
    • Go To Publisher
    • Price: 5000 Rial
    • Statistics

      Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/123541
    Collections
    • Journal of Electronic Packaging

    Show full item record

    contributor authorJ. R. Culham
    contributor authorAssociate Professor and Director
    contributor authorT. F. Lemczyk
    contributor authorProject Engineer
    contributor authorM. M. Yovanovich
    contributor authorProfessor Emeritus and Principal Scientific Advisor
    date accessioned2017-05-09T00:02:11Z
    date available2017-05-09T00:02:11Z
    date copyrightSeptember, 2000
    date issued2000
    identifier issn1528-9044
    identifier otherJEPAE4-26184#233_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/123541
    description abstractThe need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1]
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution
    typeJournal Paper
    journal volume122
    journal issue3
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.1287928
    journal fristpage233
    journal lastpage239
    identifier eissn1043-7398
    keywordsTemperature
    keywordsBoundary-value problems
    keywordsFourier series
    keywordsElectronic packages
    keywordsThermal characterization
    keywordsCavities
    keywordsEquations
    keywordsMulti-chip modules
    keywordsModeling AND Heat
    treeJournal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003
    contenttypeFulltext
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian
     
    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian