Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series SolutionSource: Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003::page 233Author:J. R. Culham
,
Associate Professor and Director
,
T. F. Lemczyk
,
Project Engineer
,
M. M. Yovanovich
,
Professor Emeritus and Principal Scientific Advisor
DOI: 10.1115/1.1287928Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1]
keyword(s): Temperature , Boundary-value problems , Fourier series , Electronic packages , Thermal characterization , Cavities , Equations , Multi-chip modules , Modeling AND Heat ,
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contributor author | J. R. Culham | |
contributor author | Associate Professor and Director | |
contributor author | T. F. Lemczyk | |
contributor author | Project Engineer | |
contributor author | M. M. Yovanovich | |
contributor author | Professor Emeritus and Principal Scientific Advisor | |
date accessioned | 2017-05-09T00:02:11Z | |
date available | 2017-05-09T00:02:11Z | |
date copyright | September, 2000 | |
date issued | 2000 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26184#233_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123541 | |
description abstract | The need to accurately predict component junction temperatures on fully operational printed circuit boards can lead to complex and time consuming simulations if component details are to be adequately resolved. An analytical approach for characterizing electronic packages is presented, based on the steady-state solution of the Laplace equation for general rectangular geometries, where boundary conditions are uniformly specified over specific regions of the package. The basis of the solution is a general three-dimensional Fourier series solution which satisfies the conduction equation within each layer of the package. The application of boundary conditions at the fluid-solid, package-board and layer-layer interfaces provides a means for obtaining a unique analytical solution for complex IC packages. Comparisons are made with published experimental data for both a plastic quad flat package and a multichip module to demonstrate that an analytical approach can offer an accurate and efficient solution procedure for the thermal characterization of electronic packages. [S1043-7398(00)01403-1] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Thermal Characterization of Electronic Packages Using a Three-Dimensional Fourier Series Solution | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1287928 | |
journal fristpage | 233 | |
journal lastpage | 239 | |
identifier eissn | 1043-7398 | |
keywords | Temperature | |
keywords | Boundary-value problems | |
keywords | Fourier series | |
keywords | Electronic packages | |
keywords | Thermal characterization | |
keywords | Cavities | |
keywords | Equations | |
keywords | Multi-chip modules | |
keywords | Modeling AND Heat | |
tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 003 | |
contenttype | Fulltext |