contributor author | S. M. Heinrich | |
contributor author | J. Liang | |
contributor author | P. S. Lee | |
contributor author | S. Shakya | |
date accessioned | 2017-05-09T00:02:10Z | |
date available | 2017-05-09T00:02:10Z | |
date copyright | December, 2000 | |
date issued | 2000 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26186#328_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/123526 | |
description abstract | An analytical model is developed for predicting the time-dependent shearing displacement in area-array solder interconnects due to global CTE mismatch under thermal cycling. As a first step toward incorporating the creep deformation of the solder, the material is modeled as viscoelastic and temperature-independent. This permits one to invoke the correspondence principle of viscoelasticity to map the authors’ previously derived, closed-form solution for an elastic nonprismatic (concave, convex, or cylindrical) Timoshenko beam under shear loading into the associated viscoelastic solution. This leads to general analytical results for the frequency-dependent shear displacement amplitude in the critical joint. The results are expressed conveniently in terms of a “full-creep correction factor” and a “frequency correction factor,” which explicitly show the effects of the following parameters on the joint deformation: joint shape; array population; array, component, and substrate dimensions; viscoelastic material properties of the interconnect material; elastic properties of the component and substrate materials; and loading frequency. To demonstrate the technique for a particular viscoelastic constitutive law, the solder is assumed to behave elastically under hydrostatic loads and as a viscoelastic Kelvin solid under deviatoric conditions. For this special case the creep portion of the deformation is shown to be dependent upon only two dimensionless parameters: a dimensionless loading frequency and a material- and shape-dependent joint parameter. The results of the study may be useful in identifying design and process modifications that may improve the thermal fatigue life of area arrays. [S1043-7398(00)00404-7] | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | An Analytical Model for Time-Dependent Shearing Deformation in Area-Array Interconnects | |
type | Journal Paper | |
journal volume | 122 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.1289631 | |
journal fristpage | 328 | |
journal lastpage | 334 | |
identifier eissn | 1043-7398 | |
keywords | Creep | |
keywords | Solders | |
keywords | Viscoelastic materials | |
keywords | Stress | |
keywords | Displacement | |
keywords | Shapes | |
keywords | Shear deformation | |
keywords | Shear (Mechanics) | |
keywords | Stiffness | |
keywords | Shearing | |
keywords | Deformation | |
keywords | Dimensions | |
keywords | Temperature | |
keywords | Hydrostatics | |
keywords | Viscoelasticity AND Design | |
tree | Journal of Electronic Packaging:;2000:;volume( 122 ):;issue: 004 | |
contenttype | Fulltext | |