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    Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001::page 73
    Author:
    M. Behnia
    ,
    H. Mishima
    ,
    W. Nakayama
    ,
    A. A. Dehghan
    DOI: 10.1115/1.2792289
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Natural convection immersion cooling of discrete heat sources in a series of parallel interacting open-top cavities filled with a fluorinert liquid (FC–72) has been numerically studied. A series of open-top slots which are confined by conductive vertical walls with two heat sources on one side are considered. One of the slots is modeled and simulated. The effect of the separation between the heat sources on the flow and heat transfer characteristics of the wall and the effect of strength of the lower heat source (which location is upstream of the other one) on the flow and heat transfer of the upper heat source are considered. The wall thermal conductivity considered ranges from adiabatic to alumina-ceramic. The results of bakelite and alumina-ceramic are shown, which are commonly used as wiring boards in electronic equipment. It is found that conduction in the wall is very important and enhances the heat transfer performance.
    keyword(s): Heat , Cooling , Natural convection , Cavities , Heat transfer , Ceramics , Flow (Dynamics) , Electrical wires , Heat conduction , Lumber , Thermal conductivity , Electronic equipment AND Separation (Technology) ,
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      Natural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/120292
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    • Journal of Electronic Packaging

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    contributor authorM. Behnia
    contributor authorH. Mishima
    contributor authorW. Nakayama
    contributor authorA. A. Dehghan
    date accessioned2017-05-08T23:56:20Z
    date available2017-05-08T23:56:20Z
    date copyrightMarch, 1998
    date issued1998
    identifier issn1528-9044
    identifier otherJEPAE4-26165#73_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120292
    description abstractNatural convection immersion cooling of discrete heat sources in a series of parallel interacting open-top cavities filled with a fluorinert liquid (FC–72) has been numerically studied. A series of open-top slots which are confined by conductive vertical walls with two heat sources on one side are considered. One of the slots is modeled and simulated. The effect of the separation between the heat sources on the flow and heat transfer characteristics of the wall and the effect of strength of the lower heat source (which location is upstream of the other one) on the flow and heat transfer of the upper heat source are considered. The wall thermal conductivity considered ranges from adiabatic to alumina-ceramic. The results of bakelite and alumina-ceramic are shown, which are commonly used as wiring boards in electronic equipment. It is found that conduction in the wall is very important and enhances the heat transfer performance.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleNatural Convection Cooling of Multiple Heat Sources in Parallel Open-Top Cavities Filled With a Fluorinert Liquid
    typeJournal Paper
    journal volume120
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792289
    journal fristpage73
    journal lastpage81
    identifier eissn1043-7398
    keywordsHeat
    keywordsCooling
    keywordsNatural convection
    keywordsCavities
    keywordsHeat transfer
    keywordsCeramics
    keywordsFlow (Dynamics)
    keywordsElectrical wires
    keywordsHeat conduction
    keywordsLumber
    keywordsThermal conductivity
    keywordsElectronic equipment AND Separation (Technology)
    treeJournal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001
    contenttypeFulltext
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