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    Shearing Deformation in Partial Areal Arrays: Analytical Results

    Source: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001::page 18
    Author:
    S. M. Heinrich
    ,
    P. S. Lee
    ,
    S. Shakya
    DOI: 10.1115/1.2792279
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Simple, closed-form expressions, based on elasticity theory, are derived for determining the location and magnitude of the maximum shearing displacement in a partial areal array of solder joints. Both uniform and nonuniform thermal loadings are considered, as is the heterogeneity of the component, which often arises due to different values of coefficient of thermal expansion (CTE) and elastic properties among the module’s constituent materials. The model is based on the following assumptions: (a) the square geometry of the array and component may be replaced with an equivalent axisymmetric geometry; and (b) the stiffness of the solder joints is negligible with respect to that of the component and substrate. The “soft joint” assumption corresponds to low-modulus solders or to thermal excursions occurring at high temperatures or low frequencies, for which significant stress relaxation occurs in the solder. For arrays exhibiting higher stiffness characteristics, the model yields conservative estimates of shearing displacement. Results indicate that, unlike homogeneous-component models under uniform temperature changes, the critical joints are not necessarily at the outer corners of the array. Other candidate locations predicted by the model (and observed in experimental and numerical studies) include the inner corner joints and any joints positioned beneath the die corners. The analytical results, also presented graphically, are found to depend on only three dimensionless parameters: the ratio of inner to outer array dimension, the ratio of die size to outer array dimension, and a “mismatch parameter,” which depends on the material, geometry, and loading characteristics of the problem. The results can be used to quickly determine the location and magnitude of peak shearing displacement in the array, possibly minimizing or eliminating the need to perform expensive and time-consuming finite element macroanalyses on entire assemblies involving hundreds of joints. Thus, the analyst may proceed directly to a detailed finite element microanalysis of the critical joint for fatigue life estimation, using the calculated shearing displacement as a required boundary condition in the finite element model.
    keyword(s): Thermal expansion , Elasticity , Temperature , Solders , Dimensions , Relaxation (Physics) , Stress , Corners (Structural elements) , Finite element analysis , Boundary-value problems , Displacement , Fatigue life , Finite element model , Frequency , Geometry , Shear deformation , Shearing , Solder joints , Stiffness AND High temperature ,
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      Shearing Deformation in Partial Areal Arrays: Analytical Results

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/120283
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    • Journal of Electronic Packaging

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    contributor authorS. M. Heinrich
    contributor authorP. S. Lee
    contributor authorS. Shakya
    date accessioned2017-05-08T23:56:19Z
    date available2017-05-08T23:56:19Z
    date copyrightMarch, 1998
    date issued1998
    identifier issn1528-9044
    identifier otherJEPAE4-26165#18_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/120283
    description abstractSimple, closed-form expressions, based on elasticity theory, are derived for determining the location and magnitude of the maximum shearing displacement in a partial areal array of solder joints. Both uniform and nonuniform thermal loadings are considered, as is the heterogeneity of the component, which often arises due to different values of coefficient of thermal expansion (CTE) and elastic properties among the module’s constituent materials. The model is based on the following assumptions: (a) the square geometry of the array and component may be replaced with an equivalent axisymmetric geometry; and (b) the stiffness of the solder joints is negligible with respect to that of the component and substrate. The “soft joint” assumption corresponds to low-modulus solders or to thermal excursions occurring at high temperatures or low frequencies, for which significant stress relaxation occurs in the solder. For arrays exhibiting higher stiffness characteristics, the model yields conservative estimates of shearing displacement. Results indicate that, unlike homogeneous-component models under uniform temperature changes, the critical joints are not necessarily at the outer corners of the array. Other candidate locations predicted by the model (and observed in experimental and numerical studies) include the inner corner joints and any joints positioned beneath the die corners. The analytical results, also presented graphically, are found to depend on only three dimensionless parameters: the ratio of inner to outer array dimension, the ratio of die size to outer array dimension, and a “mismatch parameter,” which depends on the material, geometry, and loading characteristics of the problem. The results can be used to quickly determine the location and magnitude of peak shearing displacement in the array, possibly minimizing or eliminating the need to perform expensive and time-consuming finite element macroanalyses on entire assemblies involving hundreds of joints. Thus, the analyst may proceed directly to a detailed finite element microanalysis of the critical joint for fatigue life estimation, using the calculated shearing displacement as a required boundary condition in the finite element model.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleShearing Deformation in Partial Areal Arrays: Analytical Results
    typeJournal Paper
    journal volume120
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792279
    journal fristpage18
    journal lastpage23
    identifier eissn1043-7398
    keywordsThermal expansion
    keywordsElasticity
    keywordsTemperature
    keywordsSolders
    keywordsDimensions
    keywordsRelaxation (Physics)
    keywordsStress
    keywordsCorners (Structural elements)
    keywordsFinite element analysis
    keywordsBoundary-value problems
    keywordsDisplacement
    keywordsFatigue life
    keywordsFinite element model
    keywordsFrequency
    keywordsGeometry
    keywordsShear deformation
    keywordsShearing
    keywordsSolder joints
    keywordsStiffness AND High temperature
    treeJournal of Electronic Packaging:;1998:;volume( 120 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian