Solder Joint Formation Simulation and Component Tombstoning Prediction During ReflowSource: Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002::page 141DOI: 10.1115/1.2792601Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The failure of electrical devices associated with solder joints has become one of the most critical reliability issues for surface-mounted devices. Solder joint reliability performance has been found to be highly dependent on the solder joint configuration, which, in turn, is governed by bond pad size, alloy material, and leadframe structure, as well as solder reflow characteristics. To investigate tombstone effects causing solder joint failure during leadless component reflow process, this work has focused on (1) developing a numerical model for the simulations of the solder joint formation during the reflow process, and (2) determining possibility that a tombstone effect for the leadless component may occur by analyzing the force and torque in the problem. Using this methodology, the tombstone effect associated with different pad geometry configurations and solder paste amount has been analyzed through the application of the public domain software tool Surface Evolver. Simulations show that the tombstoning is very sensitive to pad/component geometry design, solder surface tension, solder paste volume, wetting area, and wetting angle. This model simulation can be used to determine optimal solder paste volume, pad geometry configurations, and solder material for avoiding tombstone effects.
keyword(s): Simulation , Solder joints , Solders , Geometry , Engineering simulation , Reliability , Failure , Wetting (Surface science) , Design , Computer simulation , Force , Torque , Surface tension , Alloys , Computer software AND Reflow soldering ,
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contributor author | X. Wu | |
contributor author | X. Dou | |
contributor author | C.-P. Yeh | |
contributor author | K. Waytt | |
date accessioned | 2017-05-08T23:56:17Z | |
date available | 2017-05-08T23:56:17Z | |
date copyright | June, 1998 | |
date issued | 1998 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26166#141_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120263 | |
description abstract | The failure of electrical devices associated with solder joints has become one of the most critical reliability issues for surface-mounted devices. Solder joint reliability performance has been found to be highly dependent on the solder joint configuration, which, in turn, is governed by bond pad size, alloy material, and leadframe structure, as well as solder reflow characteristics. To investigate tombstone effects causing solder joint failure during leadless component reflow process, this work has focused on (1) developing a numerical model for the simulations of the solder joint formation during the reflow process, and (2) determining possibility that a tombstone effect for the leadless component may occur by analyzing the force and torque in the problem. Using this methodology, the tombstone effect associated with different pad geometry configurations and solder paste amount has been analyzed through the application of the public domain software tool Surface Evolver. Simulations show that the tombstoning is very sensitive to pad/component geometry design, solder surface tension, solder paste volume, wetting area, and wetting angle. This model simulation can be used to determine optimal solder paste volume, pad geometry configurations, and solder material for avoiding tombstone effects. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Solder Joint Formation Simulation and Component Tombstoning Prediction During Reflow | |
type | Journal Paper | |
journal volume | 120 | |
journal issue | 2 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792601 | |
journal fristpage | 141 | |
journal lastpage | 144 | |
identifier eissn | 1043-7398 | |
keywords | Simulation | |
keywords | Solder joints | |
keywords | Solders | |
keywords | Geometry | |
keywords | Engineering simulation | |
keywords | Reliability | |
keywords | Failure | |
keywords | Wetting (Surface science) | |
keywords | Design | |
keywords | Computer simulation | |
keywords | Force | |
keywords | Torque | |
keywords | Surface tension | |
keywords | Alloys | |
keywords | Computer software AND Reflow soldering | |
tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 002 | |
contenttype | Fulltext |