| contributor author | A. J. Fossett | |
| contributor author | A. A. Kudirka | |
| contributor author | D. A. Brown | |
| contributor author | F. E. Mills | |
| contributor author | M. T. Maguire | |
| date accessioned | 2017-05-08T23:56:14Z | |
| date available | 2017-05-08T23:56:14Z | |
| date copyright | September, 1998 | |
| date issued | 1998 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26167#238_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120245 | |
| description abstract | Analysis for an avionics application typical of remotely located, intermittently operated avionics on aircraft and missiles show that a large weight reduction (about 9:1) can be obtained by using recently developed microencapsulated phase change materials technology instead of a solid aluminum plate for a passive heat sink. Tests with a configuration based on the typical avionics application used for analysis show good agreement with analysis. Use of microencapsulated rather than bulk phase change materials avoids a number of design problems previously encountered with application of such materials. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Avionics Passive Cooling With Microencapsulated Phase Change Materials | |
| type | Journal Paper | |
| journal volume | 120 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792628 | |
| journal fristpage | 238 | |
| journal lastpage | 242 | |
| identifier eissn | 1043-7398 | |
| keywords | Phase change materials | |
| keywords | Cooling | |
| keywords | Avionics | |
| keywords | Weight (Mass) | |
| keywords | Aluminum plate | |
| keywords | Design | |
| keywords | Aircraft | |
| keywords | Heat sinks AND Missiles | |
| tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 003 | |
| contenttype | Fulltext | |