contributor author | J. Jiao | |
contributor author | C. K. Gurumurthy | |
contributor author | Y. Sha | |
contributor author | C. Y. Hui | |
contributor author | P. Borgesen | |
contributor author | E. J. Kramer | |
date accessioned | 2017-05-08T23:56:13Z | |
date available | 2017-05-08T23:56:13Z | |
date copyright | December, 1998 | |
date issued | 1998 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26169#349_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/120231 | |
description abstract | The interfacial fracture resistance of a polyimide passivation/underfill interface was measured using an asymmetric double cantilever beam technique. A thin layer of polyimide was coated on a standard epoxy as one of the beams and an underfill was flowed over the polyimide film and cured to form the second beam. The relative contributions of the thermal and mechanical stress were systematically varied by varying the thickness ratio of the two beams. The results indicate that the effect of thermal residual stress must be taken into account in the calculation of critical strain energy release rate to obtain the interfacial fracture energy. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Measurement of Interfacial Fracture Toughness Under Combined Mechanical and Thermal Stresses | |
type | Journal Paper | |
journal volume | 120 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792645 | |
journal fristpage | 349 | |
journal lastpage | 353 | |
identifier eissn | 1043-7398 | |
keywords | Cantilever beams | |
keywords | Electrical resistance | |
keywords | Stress | |
keywords | Epoxy adhesives | |
keywords | Thermal stresses | |
keywords | Fracture (Process) | |
keywords | Fracture toughness AND Thickness | |
tree | Journal of Electronic Packaging:;1998:;volume( 120 ):;issue: 004 | |
contenttype | Fulltext | |