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    Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

    Source: Journal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001::page 17
    Author:
    S. M. You
    ,
    T. W. Simon
    ,
    A. Bar-Cohen
    DOI: 10.1115/1.2792195
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: Results from pool boiling heat transfer experiments with flush-mounted, square heat sources on a vertical surface cooled with electronic cooling fluid, FC-72, are presented. The fluid contains moderate levels of a dissolved, noncondensable gas. Each heat source, 25mm2 in area, has an aluminum oxide surface covering a sputtered thin film of platinum. It is intended that these heaters and their juxtaposition simulate the distribution of heating on semiconductor chip arrays. The results show that, in pool boiling, the incipience event is highly variable, while the remainder of the boiling curve is repeatable. The effect of heating an element on the initiation of boiling of nearby elements is documented. Boiling from a heater below the test heater is shown to eliminate the excursion in temperature at incipience. This is attributed to the transport of noncondensable gas component which is contained in the rising bubbles to the embryonic bubbles which reside within the test heater surface. Such transport allows a concomitant rise of the gas partial pressure within the embryonic bubbles.
    keyword(s): Heat transfer AND Pool boiling ,
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      Pool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/118549
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    contributor authorS. M. You
    contributor authorT. W. Simon
    contributor authorA. Bar-Cohen
    date accessioned2017-05-08T23:53:13Z
    date available2017-05-08T23:53:13Z
    date copyrightMarch, 1997
    date issued1997
    identifier issn1528-9044
    identifier otherJEPAE4-26158#17_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/118549
    description abstractResults from pool boiling heat transfer experiments with flush-mounted, square heat sources on a vertical surface cooled with electronic cooling fluid, FC-72, are presented. The fluid contains moderate levels of a dissolved, noncondensable gas. Each heat source, 25mm2 in area, has an aluminum oxide surface covering a sputtered thin film of platinum. It is intended that these heaters and their juxtaposition simulate the distribution of heating on semiconductor chip arrays. The results show that, in pool boiling, the incipience event is highly variable, while the remainder of the boiling curve is repeatable. The effect of heating an element on the initiation of boiling of nearby elements is documented. Boiling from a heater below the test heater is shown to eliminate the excursion in temperature at incipience. This is attributed to the transport of noncondensable gas component which is contained in the rising bubbles to the embryonic bubbles which reside within the test heater surface. Such transport allows a concomitant rise of the gas partial pressure within the embryonic bubbles.
    publisherThe American Society of Mechanical Engineers (ASME)
    titlePool Boiling Heat Transfer With an Array of Flush-Mounted, Square Heaters on a Vertical Surface
    typeJournal Paper
    journal volume119
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2792195
    journal fristpage17
    journal lastpage25
    identifier eissn1043-7398
    keywordsHeat transfer AND Pool boiling
    treeJournal of Electronic Packaging:;1997:;volume( 119 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
    yabeshDSpacePersian