Impact of Tapering on Interfacial StressesSource: Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003::page 184Author:Boris Mirman
DOI: 10.1115/1.2792150Publisher: The American Society of Mechanical Engineers (ASME)
Abstract: The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed.
keyword(s): Stress , Thermal stresses , Stress , Equations AND Strips ,
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contributor author | Boris Mirman | |
date accessioned | 2017-05-08T23:49:48Z | |
date available | 2017-05-08T23:49:48Z | |
date copyright | September, 1996 | |
date issued | 1996 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26155#184_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116770 | |
description abstract | The reduction of interfacial thermal stresses is estimated for a bimaterial strip tapered at the edges. Simple equations for this stress reduction are proposed. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Impact of Tapering on Interfacial Stresses | |
type | Journal Paper | |
journal volume | 118 | |
journal issue | 3 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792150 | |
journal fristpage | 184 | |
journal lastpage | 187 | |
identifier eissn | 1043-7398 | |
keywords | Stress | |
keywords | Thermal stresses | |
keywords | Stress | |
keywords | Equations AND Strips | |
tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 003 | |
contenttype | Fulltext |