| contributor author | T. E. Voth | |
| contributor author | T. L. Bergman | |
| date accessioned | 2017-05-08T23:49:47Z | |
| date available | 2017-05-08T23:49:47Z | |
| date copyright | December, 1996 | |
| date issued | 1996 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26156#214_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/116758 | |
| description abstract | The thermomechanical response of ball-grid array assemblies during reflow soldering is considered here. Experiments are performed to investigate the thermomechanical response of a representative system and the results are used to validate a numerical model of system behavior. The conclusions drawn from the experimental studies are used to guide development of a process model capable of describing more realistic BGA soldering scenarios. Process model predictions illustrate the system’s thermomechanical response to thermal and mechanical processing conditions, as well as component properties. High thermal conductivity assemblies show the greatest sensitivity to mechanical loading conditions. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Ball Grid Array Thermomechanical Response During Reflow Assembly | |
| type | Journal Paper | |
| journal volume | 118 | |
| journal issue | 4 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792155 | |
| journal fristpage | 214 | |
| journal lastpage | 222 | |
| identifier eissn | 1043-7398 | |
| keywords | Soldering | |
| keywords | Computer simulation | |
| keywords | Materials properties | |
| keywords | Thermal conductivity | |
| keywords | Reflow soldering AND Project tasks | |
| tree | Journal of Electronic Packaging:;1996:;volume( 118 ):;issue: 004 | |
| contenttype | Fulltext | |