contributor author | Pardeep K. Bhatti | |
contributor author | Klaus Gschwend | |
contributor author | Abel Y. Kwang | |
contributor author | Ahmer R. Syed | |
date accessioned | 2017-05-08T23:46:56Z | |
date available | 2017-05-08T23:46:56Z | |
date copyright | March, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26147#20_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115172 | |
description abstract | Three-dimensional finite element analysis has been applied for determining time-dependent solder joint response of leaded surface mount components under thermal cycling. Two main challenges are the geometric complexity in mesh development and computationally intensive analysis because of the highly nonlinear material properties. Advanced techniques have been applied, including multi-point constraints for mesh transition, which reduces the number of degrees of freedom in the model, and substructuring, which effectively reduces computational time in the iterative analysis. The result is a generic approach for nonlinear creep analysis using commercial FEA software on a high performance workstation. Illustrations are provided for J and gullwing leaded packages. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Three-Dimensional Creep Analysis of Solder Joints in Surface Mount Devices | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 1 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792063 | |
journal fristpage | 20 | |
journal lastpage | 25 | |
identifier eissn | 1043-7398 | |
keywords | Creep | |
keywords | Solder joints | |
keywords | Surface mount devices | |
keywords | Finite element analysis | |
keywords | Computer software | |
keywords | Materials properties | |
keywords | Degrees of freedom AND Surface mount components | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 001 | |
contenttype | Fulltext | |