| contributor author | Zeng-Yuan Guo | |
| contributor author | Yun-Sheng Xu | |
| date accessioned | 2017-05-08T23:46:53Z | |
| date available | 2017-05-08T23:46:53Z | |
| date copyright | September, 1995 | |
| date issued | 1995 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26150#174_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115138 | |
| description abstract | Instead of the classic Fourier equation based on diffusion, a hyperbolic equation based on a wave model has been used to predict the rapid transient heat conduction in IC chips. The peak temperature, spatial difference, and time variation of temperature, which are critical to thermal reliability of the chip, are given and compared with that obtained from the Fourier equation. Analytical and numerical results show that non-Fourier effects, including the higher peak temperature and thermal stress, greater temperature difference between components, and stronger thermal noise, are significant to IC chip reliability. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Non-Fourier Heat Conduction in IC Chip | |
| type | Journal Paper | |
| journal volume | 117 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2792088 | |
| journal fristpage | 174 | |
| journal lastpage | 177 | |
| identifier eissn | 1043-7398 | |
| keywords | Heat conduction | |
| keywords | Temperature | |
| keywords | Equations | |
| keywords | Reliability | |
| keywords | Waves | |
| keywords | Thermal stresses | |
| keywords | Noise (Sound) | |
| keywords | Transient heat AND Diffusion (Physics) | |
| tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 003 | |
| contenttype | Fulltext | |