contributor author | D. Mukutmoni | |
contributor author | Y. K. Joshi | |
contributor author | M. D. Kelleher | |
date accessioned | 2017-05-08T23:46:52Z | |
date available | 2017-05-08T23:46:52Z | |
date copyright | December, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26151#294_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115129 | |
description abstract | A computational study of natural convection in an enclosure as applied to applications in cooling of electronic components is reported. The investigation is for a configuration consisting of a three by three array of heated protrusions placed on a vertical substrate. The vertical sidewalls are all insulated, and the top and bottom walls serve as isothermal heat sinks. A thin layer at the back of each protrusion is the heat source, where heat is generated uniformly and volumetrically. The coolant is the flourinert liquid FC75. The code was first validated with experimental results reported earlier on the same configuration. The effect of the substrate conductivity, κs on the heat transfer and fluid flow was then studied for power levels of 0.1 and 0.7 Watts per protrusion. The computations indicate that the effect of increasing κs is dramatic. The protrusion temperatures which were found to be nominally steady, were substantially reduced. The percentage of generated power that is directly conducted to the substrate increased with an increase in κs . The fluid velocity field, which was unsteady, was not significantly affected by changes in κs . | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Computations for a Three-by-Three Array of Protrusions Cooled by Liquid Immersion: Effect of Substrate Thermal Conductivity | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792108 | |
journal fristpage | 294 | |
journal lastpage | 300 | |
identifier eissn | 1043-7398 | |
keywords | Thermal conductivity | |
keywords | Computation | |
keywords | Heat | |
keywords | Temperature | |
keywords | Heat transfer | |
keywords | Cooling | |
keywords | Fluids | |
keywords | Electrical measurement | |
keywords | Coolants | |
keywords | Conductivity | |
keywords | Heat sinks | |
keywords | Electronic components | |
keywords | Natural convection AND Fluid dynamics | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
contenttype | Fulltext | |