contributor author | J. J. Miles | |
contributor author | C. R. Zelak | |
contributor author | J. M. Kliman | |
contributor author | J. E. Sunderland | |
date accessioned | 2017-05-08T23:46:52Z | |
date available | 2017-05-08T23:46:52Z | |
date copyright | December, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26151#288_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115128 | |
description abstract | A method is presented to test automatically for latent faults, those which elude detection during conventional electronic testing, on printed circuit boards. Testing is intended for implementation in a volume manufacturing environment and involves the application of infrared imaging tools. Successful incorporation of infrared testing into existing test processes requires that: a procedure for handling variable radiation heat transfer properties across a printed circuit board be developed; a thermally-controlled test enclosure be provided; PASS/FAIL criteria be established. These tasks are addressed, testing procedures are described, and favorable results are presented. The feasibility of an infrared test process is demonstrated. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Integrated Infrared Failure Analysis of Printed Circuit Boards | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792107 | |
journal fristpage | 288 | |
journal lastpage | 293 | |
identifier eissn | 1043-7398 | |
keywords | Failure analysis | |
keywords | Printed circuit boards | |
keywords | Testing | |
keywords | Infrared imaging | |
keywords | Heat transfer | |
keywords | Radiation (Physics) | |
keywords | Manufacturing AND Equipment and tools | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
contenttype | Fulltext | |