contributor author | Roger B. Clough | |
contributor author | Andrew J. Bayba | |
contributor author | George K. Lucey | |
contributor author | Alexander J. Shapiro | |
date accessioned | 2017-05-08T23:46:52Z | |
date available | 2017-05-08T23:46:52Z | |
date copyright | December, 1995 | |
date issued | 1995 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26151#270_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/115125 | |
description abstract | Composite solder connections, modeled as miniature single-lap shear layers between copper plates, were fabricated and pulled to fracture. The solder layers (3.1 × 3.1 × 0.50 mm) were eutectic lead-tin/particulate Cu6 Sn5 composites. Under load, shear fractures extended along paths about 10 µm inside of the interfaces from opposite edges. These boundary layer fractures were characterized and a fracture model was developed. A corresponding test method for measuring JII and δII , the crack extension energy and crack tip shear displacement for Mode II crack growth, is given, and the results are discussed. Composite strengthening is shown to significantly improve the ductility and the creep life, properties associated with improved reliability and creepfatigue life. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Boundary Layer Fracture in Composite Solder Joints | |
type | Journal Paper | |
journal volume | 117 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2792104 | |
journal fristpage | 270 | |
journal lastpage | 274 | |
identifier eissn | 1043-7398 | |
keywords | Composite materials | |
keywords | Boundary layers | |
keywords | Fracture (Process) | |
keywords | Solder joints | |
keywords | Shear (Mechanics) | |
keywords | Solders | |
keywords | Reliability | |
keywords | Stress | |
keywords | Ductility | |
keywords | Particulate matter | |
keywords | Creep | |
keywords | Copper | |
keywords | Plates (structures) AND Displacement | |
tree | Journal of Electronic Packaging:;1995:;volume( 117 ):;issue: 004 | |
contenttype | Fulltext | |