Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic ComponentsSource: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003::page 237DOI: 10.1115/1.2905692Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Design , Electronic components , Impingement cooling AND Thermofluids ,
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| contributor author | D. E. Maddox | |
| contributor author | A. Bar-Cohen | |
| date accessioned | 2017-05-08T23:43:56Z | |
| date available | 2017-05-08T23:43:56Z | |
| date copyright | September, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26144#237_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113435 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Thermofluid Design of Single-Phase Submerged-Jet Impingement Cooling for Electronic Components | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905692 | |
| journal fristpage | 237 | |
| journal lastpage | 240 | |
| identifier eissn | 1043-7398 | |
| keywords | Design | |
| keywords | Electronic components | |
| keywords | Impingement cooling AND Thermofluids | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003 | |
| contenttype | Fulltext |