Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular SubstrateSource: Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003::page 171Author:E. Suhir
DOI: 10.1115/1.2905682Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Thin films AND Thermal stresses ,
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| contributor author | E. Suhir | |
| date accessioned | 2017-05-08T23:43:54Z | |
| date available | 2017-05-08T23:43:54Z | |
| date copyright | September, 1994 | |
| date issued | 1994 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26144#171_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113424 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Approximate Evaluation of the Elastic Thermal Stresses in a Thin Film Fabricated on a Very Thick Circular Substrate | |
| type | Journal Paper | |
| journal volume | 116 | |
| journal issue | 3 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2905682 | |
| journal fristpage | 171 | |
| journal lastpage | 176 | |
| identifier eissn | 1043-7398 | |
| keywords | Thin films AND Thermal stresses | |
| tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 003 | |
| contenttype | Fulltext |