contributor author | Kaveh Azar | |
contributor author | Carlo D. Mandrone | |
date accessioned | 2017-05-08T23:43:54Z | |
date available | 2017-05-08T23:43:54Z | |
date copyright | December, 1994 | |
date issued | 1994 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26146#306_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113419 | |
description abstract | An experimental investigation was conducted to examine the effect of pin fin density on thermal resistance of unshrouded pin fin heat sinks. Six heat sinks with different number of round pin fins were constructed. Heat sink thermal resistance was calculated by maintaining its base temperature constant. For these experiments, air flow varied from natural to high velocity forced convection. The results showed that thermal resistance did not decrease with increase of number of pin fins. An optimum number of pin fins existed beyond which thermal resistance actually increased. The study also showed that thermal resistance was a function of air velocity and governing flow pattern. Comparison of the heat transfer coefficient (h) and pin fin surface area showed that h decreased dramatically as surface area increased. The results showed that pin fin heat sinks with small number of pins had the best performance at low and moderate forced convection cooling. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Effect of Pin Fin Density of the Thermal Performance of Unshrouded Pin Fin Heat Sinks | |
type | Journal Paper | |
journal volume | 116 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905702 | |
journal fristpage | 306 | |
journal lastpage | 309 | |
identifier eissn | 1043-7398 | |
keywords | Density | |
keywords | Heat sinks | |
keywords | Thermal resistance | |
keywords | Fins | |
keywords | Forced convection | |
keywords | Heat transfer coefficients | |
keywords | Flow (Dynamics) | |
keywords | Temperature | |
keywords | Cooling | |
keywords | Air flow AND Pins (Engineering) | |
tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
contenttype | Fulltext | |