contributor author | S. D. Rajan | |
contributor author | V. Sarihan | |
contributor author | M. Mahalingam | |
date accessioned | 2017-05-08T23:43:53Z | |
date available | 2017-05-08T23:43:53Z | |
date copyright | December, 1994 | |
date issued | 1994 | |
identifier issn | 1528-9044 | |
identifier other | JEPAE4-26146#274_1.pdf | |
identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/113415 | |
description abstract | A general design methodology for the optimal design of electronic packages is presented. The design problem is cast as a nonlinear programming (NLP) problem. Design for critical packaging issues such as thermal and mechanical performance, is automated by combining thermal and mechanical finite element analysis with an NLP optimizer. The major issues such as design problem formulation, model generation or preprocessing, nonlinear finite element analysis, design variable identification, design sensitivity analysis and software implementation are addressed. A case study involving the design of an RF packaging component in communication products illustrates the design methodology implemented in the Automated Design of Electronic Packaging (ADEP) software system. | |
publisher | The American Society of Mechanical Engineers (ASME) | |
title | Methodology for Automated Design of Microelectronic Packages | |
type | Journal Paper | |
journal volume | 116 | |
journal issue | 4 | |
journal title | Journal of Electronic Packaging | |
identifier doi | 10.1115/1.2905698 | |
journal fristpage | 274 | |
journal lastpage | 281 | |
identifier eissn | 1043-7398 | |
keywords | Design | |
keywords | Nonlinear programming | |
keywords | Packaging | |
keywords | Finite element analysis | |
keywords | Computer software | |
keywords | Design methodology | |
keywords | Design sensitivity analysis | |
keywords | Electronic packaging | |
keywords | Equipment performance AND Electronic packages | |
tree | Journal of Electronic Packaging:;1994:;volume( 116 ):;issue: 004 | |
contenttype | Fulltext | |