Special Issue on Mechanics of Surface Mount AssembliesSource: Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002::page 139Author:Donald Barker
,
Hans Conrad
,
Peter Engel
,
Tai-Ran Hsu
,
John Lau
,
Yi-Hsin Pao
,
Anthony Rafanelli
,
Harvey Solomon
,
Donald Stone
,
Frank Wu
DOI: 10.1115/1.2909308Publisher: The American Society of Mechanical Engineers (ASME)keyword(s): Surface mount assemblies ,
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| contributor author | Donald Barker | |
| contributor author | Hans Conrad | |
| contributor author | Peter Engel | |
| contributor author | Tai-Ran Hsu | |
| contributor author | John Lau | |
| contributor author | Yi-Hsin Pao | |
| contributor author | Anthony Rafanelli | |
| contributor author | Harvey Solomon | |
| contributor author | Donald Stone | |
| contributor author | Frank Wu | |
| date accessioned | 2017-05-08T23:41:06Z | |
| date available | 2017-05-08T23:41:06Z | |
| date copyright | June, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26137#139_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111805 | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Special Issue on Mechanics of Surface Mount Assemblies | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909308 | |
| journal fristpage | 139 | |
| journal lastpage | 140 | |
| identifier eissn | 1043-7398 | |
| keywords | Surface mount assemblies | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 002 | |
| contenttype | Fulltext |