| contributor author | H. Sun | |
| contributor author | W. Nakayama | |
| contributor author | C. F. Ma | |
| date accessioned | 2017-05-08T23:41:04Z | |
| date available | 2017-05-08T23:41:04Z | |
| date copyright | March, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26135#71_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111794 | |
| description abstract | An experimental study was performed to investigate the local characteristics of heat transfer from vertical simulated micro-chips to impinging submerged circular water jets. The effects of jet velocity, and nozzle-to-plate spacing were studied in the range of Re = 5.0 × 103 ̃ 3.6 × 104 . Heat transfer rates at the stagnation point and local heat transfer distributions were correlated. Transition from laminar to turbulent flow was observed. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Local Characteristics of Convective Heat Transfer From Simulated Microelectronic Chips to Impinging Submerged Round Water Jets | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909304 | |
| journal fristpage | 71 | |
| journal lastpage | 77 | |
| identifier eissn | 1043-7398 | |
| keywords | Jets | |
| keywords | Convection | |
| keywords | Water | |
| keywords | Heat transfer | |
| keywords | Turbulence | |
| keywords | Nozzles AND Integrated circuits | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001 | |
| contenttype | Fulltext | |