| contributor author | P. A. Engel | |
| contributor author | Yun Ling | |
| date accessioned | 2017-05-08T23:41:03Z | |
| date available | 2017-05-08T23:41:03Z | |
| date copyright | March, 1993 | |
| date issued | 1993 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26135#22_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/111786 | |
| description abstract | The coupling of a square base plate to another reinforcing plate is solved for torsional loads. Nondimensional analysis is carried out using thin plate theory. The distribution of connecting peripheral tie forces is shown to depend on the size ratio of the two plates, their rigidities, and the stiffness of the ties. Applications to twisted circuit cards with attached electronics modules are referred to. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Torsion of Elastically Coupled Plates With Applications to Electronic Packaging | |
| type | Journal Paper | |
| journal volume | 115 | |
| journal issue | 1 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2909297 | |
| journal fristpage | 22 | |
| journal lastpage | 27 | |
| identifier eissn | 1043-7398 | |
| keywords | Torsion | |
| keywords | Plates (structures) | |
| keywords | Electronic packaging | |
| keywords | Stress | |
| keywords | Force | |
| keywords | Circuits | |
| keywords | Stiffness AND Electronics | |
| tree | Journal of Electronic Packaging:;1993:;volume( 115 ):;issue: 001 | |
| contenttype | Fulltext | |