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    The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions

    Source: Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001::page 14
    Author:
    Ann M. Anderson
    ,
    Robert J. Moffat
    DOI: 10.1115/1.2905435
    Publisher: The American Society of Mechanical Engineers (ASME)
    Abstract: This paper describes an investigation of the forced convection heat transfer and pressure drop characteristics of a regular in-line array of flatpacks for several channel heights and inlet velocities. The work has both practical and theoretical interest since it relates to technical problems now faced by the electronics industry, and it embodies one of the most general heat transfer problems: non-uniform heat release from nonuniform geometries. To predict operating temperatures in situations where the wall temperature distribution is non-uniform, one must use superposition. Both the adiabatic heat transfer coefficient, had , and the superposition kernel functions, g*, are required. The problem can be solved using superposition directly (had and g*) or indirectly (using had and g* to calculate the correct value of hm ). Either way the superposition data is required. This work presents the first full set of superposition data for flatpack arrays. Part 1 presents heat transfer and pressure drop results and part 2 presents a model for heat transfer that is based on the maximum turbulence fluctuations in the channel.
    keyword(s): Flow (Dynamics) , Heat transfer coefficients , Heat transfer , Channels (Hydraulic engineering) , Pressure drop , Wall temperature , Electronics , Heat , Turbulence , Fluctuations (Physics) , Forced convection , Functions AND Operating temperature ,
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      The Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions

    URI
    http://yetl.yabesh.ir/yetl1/handle/yetl/110089
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    contributor authorAnn M. Anderson
    contributor authorRobert J. Moffat
    date accessioned2017-05-08T23:38:09Z
    date available2017-05-08T23:38:09Z
    date copyrightMarch, 1992
    date issued1992
    identifier issn1528-9044
    identifier otherJEPAE4-26127#14_1.pdf
    identifier urihttp://yetl.yabesh.ir/yetl/handle/yetl/110089
    description abstractThis paper describes an investigation of the forced convection heat transfer and pressure drop characteristics of a regular in-line array of flatpacks for several channel heights and inlet velocities. The work has both practical and theoretical interest since it relates to technical problems now faced by the electronics industry, and it embodies one of the most general heat transfer problems: non-uniform heat release from nonuniform geometries. To predict operating temperatures in situations where the wall temperature distribution is non-uniform, one must use superposition. Both the adiabatic heat transfer coefficient, had , and the superposition kernel functions, g*, are required. The problem can be solved using superposition directly (had and g*) or indirectly (using had and g* to calculate the correct value of hm ). Either way the superposition data is required. This work presents the first full set of superposition data for flatpack arrays. Part 1 presents heat transfer and pressure drop results and part 2 presents a model for heat transfer that is based on the maximum turbulence fluctuations in the channel.
    publisherThe American Society of Mechanical Engineers (ASME)
    titleThe Adiabatic Heat Transfer Coefficient and the Superposition Kernel Function: Part 1—Data for Arrays of Flatpacks for Different Flow Conditions
    typeJournal Paper
    journal volume114
    journal issue1
    journal titleJournal of Electronic Packaging
    identifier doi10.1115/1.2905435
    journal fristpage14
    journal lastpage21
    identifier eissn1043-7398
    keywordsFlow (Dynamics)
    keywordsHeat transfer coefficients
    keywordsHeat transfer
    keywordsChannels (Hydraulic engineering)
    keywordsPressure drop
    keywordsWall temperature
    keywordsElectronics
    keywordsHeat
    keywordsTurbulence
    keywordsFluctuations (Physics)
    keywordsForced convection
    keywordsFunctions AND Operating temperature
    treeJournal of Electronic Packaging:;1992:;volume( 114 ):;issue: 001
    contenttypeFulltext
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    DSpace software copyright © 2002-2015  DuraSpace
    نرم افزار کتابخانه دیجیتال "دی اسپیس" فارسی شده توسط یابش برای کتابخانه های ایرانی | تماس با یابش
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