| contributor author | J. Lau | |
| contributor author | S. Golwalkar | |
| contributor author | S. Erasmus | |
| contributor author | R. Surratt | |
| contributor author | P. Boysan | |
| date accessioned | 2017-05-08T23:38:08Z | |
| date available | 2017-05-08T23:38:08Z | |
| date copyright | June, 1992 | |
| date issued | 1992 | |
| identifier issn | 1528-9044 | |
| identifier other | JEPAE4-26129#169_1.pdf | |
| identifier uri | http://yetl.yabesh.ir/yetl/handle/yetl/110072 | |
| description abstract | The reliability of 0.5 mm pitch, 28-Pin Thin Small Outline Package (TSOP) solder joints has been studied by experimental temperature cycling and a cost-effective 3-D nonlinear finite element analysis. Temperature cycling results have been presented as a Weibull distribution, and an acceleration factor has been established for the failure rate at operating conditions. Thermal fatigue life of the corner solder joints has been estimated based on the calculated plastic strain, Coffin-Manson equation, and isothermal fatigue data on solders. A correlation between the experimental and analytical results has also been made. Furthermore, failure analysis of the solder joints has been performed using Scanning Electron Microscopy (SEM) and an optical method. | |
| publisher | The American Society of Mechanical Engineers (ASME) | |
| title | Experimental and Analytical Studies of 28-Pin Thin Small Outline Package (TSOP) Solder-Joint Reliability | |
| type | Journal Paper | |
| journal volume | 114 | |
| journal issue | 2 | |
| journal title | Journal of Electronic Packaging | |
| identifier doi | 10.1115/1.2906414 | |
| journal fristpage | 169 | |
| journal lastpage | 176 | |
| identifier eissn | 1043-7398 | |
| keywords | Reliability | |
| keywords | Solder joints | |
| keywords | Temperature | |
| keywords | Solders | |
| keywords | Weibull distribution | |
| keywords | Fatigue | |
| keywords | Corners (Structural elements) | |
| keywords | Finite element analysis | |
| keywords | Scanning electron microscopy | |
| keywords | Equations | |
| keywords | Failure | |
| keywords | Failure analysis AND Fatigue life | |
| tree | Journal of Electronic Packaging:;1992:;volume( 114 ):;issue: 002 | |
| contenttype | Fulltext | |